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SN74LV374ATPWREP

Texas Instruments

SN74LV374ATPWREP by Texas Instruments

SN74LV374ATPWREP by Texas Instruments is an 8-bit bus driver with a propagation delay of 18.5 ns at 3.3V, suitable for industrial applications. It features a max frequency of 50 MHz, operates b/w -40 to 105°C, and has a low power supply current of 0.02 mA. This CMOS technology transceiver has dual terminal position in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,709 parts In-Stock

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Vyrian

USA . 2,183 parts In-Stock

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2,183

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Distributors (Availability)

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Microchip USA

USA . 1,125 parts In-Stock

1+ parts

$6.523

100+ parts

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1,125

$6.523

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Andel Nordic

Denmark . 2,025 parts In-Stock

1+ parts

$7.645

100+ parts

-

1k+ parts

$7.339

10k+ parts

$7.339

2,025

$7.645

-

$7.339

$7.339

AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$19.876

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191

$19.876

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Parana Technologies

USA . 782 parts In-Stock

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$23.915

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$24.555

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782

$23.915

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$24.555

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DigiPath Technology Company

USA . 875 parts In-Stock

1+ parts

$26.334

100+ parts

$24.227

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875

$26.334

$24.227

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ChromeModa Solutions

Germany . 1,441 parts In-Stock

1+ parts

$26.871

100+ parts

$22.034

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1,441

$26.871

$22.034

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IDEA Electronic Components Group

UK . 281 parts In-Stock

1+ parts

$26.871

100+ parts

$25.527

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$24.184

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281

$26.871

$25.527

$24.184

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One Stop Electronics

USA . 625 parts In-Stock

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$55.000

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625

$55.000

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Perfect Parts

USA . 2,621 parts In-Stock

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2,621

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Corphita

USA . 281 parts In-Stock

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Overview

Unlock seamless data transmission with the SN74LV374ATPWREP by Texas Instruments. Manufactured with precision and expertise, this Bus Driver & Transceiver provides reliable signal routing for a wide range of applications. With a compact design and high-quality materials, this product ensures optimal performance and durability. Experience fast propagation delays and efficient data transfer at an unbeatable value. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring a longer lifespan.

No. of Bits: 8

Allows for a higher level of data transmission and processing, suitable for handling complex bus driver functions.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage for efficient operation and power consumption.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial environments.

Maximum Frequency At Nominal Supply: 50000000 Hz

High frequency capability enables fast data transmission and communication.

Technical Specifications

Bus Driver & Transceivers SN74LV374ATPWREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

18.5 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74LV374ATPWREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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