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SN74LV32ATPWRQ1

Texas Instruments

SN74LV32ATPWRQ1 by Texas Instruments

SN74LV32ATPWRQ1 by Texas Instruments is a CMOS logic gate with 4 functions, 2 inputs, and propagation delay of 13 ns at 2.5V. It operates in industrial temperatures (-40 to 105°C) and has a max supply voltage of 5.5V. This small outline package is ideal for automotive applications due to AEC-Q100 screening level compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,390 parts In-Stock

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Digiode

USA . 707 parts In-Stock

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707

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AZTECH Wire

Italy . 515 parts In-Stock

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$17.408

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515

$17.408

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Parana Technologies

USA . 311 parts In-Stock

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$30.168

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$2,801.587

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$27.151

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311

$30.168

$2,801.587

$27.151

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DigiPath Technology Company

USA . 1,697 parts In-Stock

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$33.219

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$30.562

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$33.219

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IDEA Electronic Components Group

UK . 1,735 parts In-Stock

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$33.897

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$32.202

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$30.507

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1,735

$33.897

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$30.507

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ChromeModa Solutions

Germany . 262 parts In-Stock

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$33.897

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$27.796

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262

$33.897

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One Stop Electronics

USA . 512 parts In-Stock

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$40.000

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Corphita

USA . 4,176 parts In-Stock

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Microchip USA

USA . 357 parts In-Stock

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Overview

Unlock the power of reliable logic gates with the SN74LV32ATPWRQ1 by Texas Instruments. Designed with quality and precision in mind, this versatile component offers seamless integration in a variety of applications. With a focus on performance and efficiency, Texas Instruments delivers a product that provides unmatched value and benefits to customers. Trust in the expertise of the manufacturer and experience the advantages of using the SN74LV32ATPWRQ1 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 13 ns

With a fast propagation delay, this logic gate can quickly process signals, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in a single component reduces the overall component count in a circuit, saving space and potentially reducing cost.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the component meets automotive-grade reliability standards, making it suitable for automotive applications.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logic operations efficiently.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V, this logic gate can be used in low-power applications, increasing efficiency.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF indicates the gate's ability to drive capacitive loads without significant signal degradation.

Power Supplies (V): 3.3

Having multiple power supply options at 3.3V allows for compatibility with a wide range of systems and circuits.

No. of Terminals: 14

With 14 terminals, this logic gate offers ample connectivity options for various circuit configurations.

Maximum I (ol): 6 Amp

With a high maximum output current of 6 Amps, this logic gate can drive larger loads without issues.

Propagation Delay (tpd): 20 ns

Although not the fastest, a propagation delay of 20 ns is still relatively quick, suitable for many general-purpose applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows this logic gate to operate reliably in elevated temperature environments.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 105°C makes this logic gate suitable for both industrial and automotive applications.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit board layout and component placement.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for compact designs and reduces the overall profile of the circuit board.

Width: 4.4 mm

The narrow width of 4.4 mm contributes to space-saving on the circuit board and allows for dense packing of components.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage of 2V, this logic gate can operate in low-power scenarios, extending battery life in portable devices.

Length: 5 mm

The compact length of 5 mm further contributes to space-saving and allows for more efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Being industrial-grade means this logic gate can withstand harsh environmental conditions and operate reliably in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various signal levels, making it a versatile choice for logic gates.

Terminal Form: GULL WING

The gull-wing terminal form is well-suited for surface mount applications, providing secure and reliable connections on the PCB.

Packing Method: TR

The TR packing method ensures safe and convenient transportation and storage of the logic gate, reducing the risk of damage during handling.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate offers fine-pitch connections for precise and compact circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options and allows for compatibility with a wide range of systems.

Technical Specifications

Logic Gates SN74LV32ATPWRQ1 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV32ATPWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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