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SN74LV126APWRG4

Texas Instruments

SN74LV126APWRG4 by Texas Instruments

SN74LV126APWRG4 by Texas Instruments is a 4-function bus driver with 13ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 2.5V and has a max operating temperature of 125°C. With surface mount capability and dual terminal position, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,544 parts In-Stock

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8,544

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Digiode

USA . 349 parts In-Stock

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349

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Andel Nordic

Denmark . 4,231 parts In-Stock

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$6.826

100+ parts

-

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$6.553

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$6.553

4,231

$6.826

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$6.553

$6.553

Parana Technologies

USA . 807 parts In-Stock

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$11.752

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$12.151

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807

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DigiPath Technology Company

USA . 881 parts In-Stock

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$12.940

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$11.905

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881

$12.940

$11.905

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ChromeModa Solutions

Germany . 4,426 parts In-Stock

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$13.204

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$10.827

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4,426

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$10.827

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IDEA Electronic Components Group

UK . 1,137 parts In-Stock

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$13.204

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$12.544

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$11.884

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1,137

$13.204

$12.544

$11.884

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AZTECH Wire

Italy . 718 parts In-Stock

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$16.665

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718

$16.665

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One Stop Electronics

USA . 204 parts In-Stock

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$29.000

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QUARKTWIN TECHNOLOGY LTD

USA . 17,522 parts In-Stock

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Microchip USA

USA . 3,280 parts In-Stock

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Corphita

USA . 2,934 parts In-Stock

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Overview

Elevate your electronic designs with the SN74LV126APWRG4 by Texas Instruments, a cutting-edge bus driver and transceiver that boasts unparalleled quality and reliability. Manufactured with precision and expertise, this product offers 4 functions in a compact rectangular package, perfect for applications requiring fast propagation delay and low power consumption. With a wide temperature grade range and advanced CMOS technology, this versatile device is ideal for automotive and industrial uses. Experience seamless integration, exceptional performance, and superior value with the SN74LV126APWRG4 - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 13 ns

The low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed data communication applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 2.5

With a low supply voltage requirement, this bus driver is energy-efficient and ideal for low-power applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for greater flexibility in controlling the bus lines, enabling versatile connectivity options.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable performance in harsh environmental conditions, making it suitable for automotive applications.

Technical Specifications

Bus Driver & Transceivers SN74LV126APWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74LV126APWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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