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SN74LV125APWRG4

Texas Instruments

SN74LV125APWRG4 by Texas Instruments

SN74LV125APWRG4 by Texas Instruments is a 4-function bus driver with 13ns propagation delay and 18.5ns tpd. It operates at Vsup of 2-5.5V, has dual terminal position, and is suitable for automotive applications due to its -40 to 125°C operating temperature range.

Median Price

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Lifecycle Status

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8

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Chip Stock

USA . 68,560 parts In-Stock

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Vyrian

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Nova Conductors

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Andel Nordic

Denmark . 4,710 parts In-Stock

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$7.955

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AZTECH Wire

Italy . 676 parts In-Stock

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$11.917

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Ampacity Inc.

Singapore . 1,554 parts In-Stock

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Parana Technologies

USA . 369 parts In-Stock

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DigiPath Technology Company

USA . 667 parts In-Stock

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IDEA Electronic Components Group

UK . 2,082 parts In-Stock

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ChromeModa Solutions

Germany . 1,252 parts In-Stock

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Semicontronic

India . 1,259 parts In-Stock

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Corohmni

South Africa . 654 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Microchip USA

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Argo Parts USA

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Overview

Elevate your electronics with the SN74LV125APWRG4 by Texas Instruments, a top-tier bus driver and transceiver that sets the standard for quality and reliability. Designed with precision in mind, this product delivers seamless performance across various applications, ensuring optimal results every time. With a focus on efficiency and innovation, Texas Instruments guarantees that you'll experience unmatched value and benefits when you choose the SN74LV125APWRG4, making it a must-have for any project or system integration. Trust in Texas Instruments to provide the solutions you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection for the internal components of the bus driver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 13 ns

Low propagation delay ensures fast and efficient signal transmission, making this bus driver suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving time and effort during the assembly process.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low nominal supply voltage of 2.5V, making it suitable for battery-powered applications where power efficiency is crucial.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the bus driver, enabling tri-state outputs for bus sharing applications and reducing power consumption when not actively driving the bus.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature range ensures reliable operation in harsh environments, making this bus driver suitable for automotive applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver energy-efficient and reliable in noisy electrical environments.

Technical Specifications

Bus Driver & Transceivers SN74LV125APWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV125APWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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