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SN74LV10APWT

Texas Instruments

SN74LV10APWT by Texas Instruments

SN74LV10APWT by Texas Instruments is a logic gate with 3 functions and inputs, featuring a propagation delay of 13.5 ns at 2.5V supply voltage. This CMOS technology device operates in industrial temperature range (-40 to 85 °C) and has a max seated height of 1.2 mm, making it suitable for various electronic applications requiring fast signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,606 parts In-Stock

1+ parts

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4,606

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Vyrian

USA . 2,827 parts In-Stock

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2,827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 853 parts In-Stock

1+ parts

$10.933

100+ parts

-

1k+ parts

$11.400

10k+ parts

-

853

$10.933

-

$11.400

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DigiPath Technology Company

USA . 322 parts In-Stock

1+ parts

$12.038

100+ parts

$11.075

1k+ parts

-

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322

$12.038

$11.075

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ChromeModa Solutions

Germany . 5,307 parts In-Stock

1+ parts

$12.284

100+ parts

$10.073

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-

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5,307

$12.284

$10.073

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$12.284

100+ parts

$11.670

1k+ parts

$11.056

10k+ parts

-

2,302

$12.284

$11.670

$11.056

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AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$15.439

100+ parts

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361

$15.439

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One Stop Electronics

USA . 635 parts In-Stock

1+ parts

$40.000

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635

$40.000

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Microchip USA

USA . 5,428 parts In-Stock

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5,428

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Corphita

USA . 4,026 parts In-Stock

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4,026

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Overview

Unlock endless possibilities with the Texas Instruments SN74LV10APWT Logic Gates. Crafted with precision and reliability in mind, this product offers a seamless experience for your electronic projects. With a sleek design and top-notch performance, it is perfect for a wide range of applications. Enhance your projects with its fast propagation delay, low power consumption, and compact package style. Trust in Texas Instruments for quality and innovation that exceeds expectations. Elevate your creations with the SN74LV10APWT Logic Gates today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 13.5 ns

Low propagation delay ensures fast and efficient operation of the logic gates.

No. of Functions: 3

Having multiple functions in a single device provides versatility and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage ensures stable and reliable performance of the logic gates.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates SN74LV10APWT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV10APWT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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