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SN74LV08ATPWRQ1

Texas Instruments

SN74LV08ATPWRQ1 by Texas Instruments

SN74LV08ATPWRQ1 by Texas Instruments is a CMOS logic gate with 4 functions, 2 inputs, and a propagation delay of 16 ns at 3.3V. It is designed for industrial applications requiring high-speed signal processing in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,467 parts In-Stock

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Digiode

USA . 4,987 parts In-Stock

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AZTECH Wire

Italy . 421 parts In-Stock

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$16.914

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421

$16.914

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One Stop Electronics

USA . 1,276 parts In-Stock

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$22.000

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Parana Technologies

USA . 336 parts In-Stock

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$22.955

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$23.608

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336

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ChromeModa Solutions

Germany . 1,925 parts In-Stock

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$25.792

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$21.149

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$25.792

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IDEA Electronic Components Group

UK . 711 parts In-Stock

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$25.792

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$24.502

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$23.213

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711

$25.792

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Corphita

USA . 4,739 parts In-Stock

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DigiPath Technology Company

USA . 975 parts In-Stock

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$23.254

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Microchip USA

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Overview

Enhance your electronic designs with the SN74LV08ATPWRQ1 by Texas Instruments, a high-quality logic gate offering unmatched reliability and performance. With 4 functions, 2 inputs, and AEC-Q100 screening, this versatile component is perfect for automotive, industrial, and consumer applications. Experience the benefits of its low propagation delay, compact package, and wide operating temperature range. Trust in Texas Instruments for cutting-edge technology that delivers value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package, ensuring long-term performance.

Propagation Delay At Nominal Supply: 16 ns

Fast propagation delay at nominal supply voltage allows for quick processing of signals within the logic gates.

Surface Mount: YES

Surface mount capability makes installation of the logic gates easier and more convenient for electronic circuit design.

No. of Functions: 4

Having multiple functions in a single component helps to simplify circuit design and save space on the PCB.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability of the logic gates, making them suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common 3.3V supply voltage, compatible with many electronic devices and systems.

Load Capacitance (CL): 50 pF

Designed to handle a load capacitance of 50 pF, ensuring stability in different circuit configurations.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the logic gates can withstand elevated temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in low temperatures down to -40°C, making them suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the logic gates.

Technical Specifications

Logic Gates SN74LV08ATPWRQ1 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV08ATPWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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