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SN74LS51NSR

Texas Instruments

SN74LS51NSR by Texas Instruments

SN74LS51NSR by Texas Instruments is a TTL logic gate with 2 functions and 4 inputs. It has a propagation delay of 20 ns at 5V, making it suitable for applications requiring fast signal processing. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,961 parts In-Stock

1+ parts

$1.850

100+ parts

$1.107

1k+ parts

$0.972

10k+ parts

$0.901

1,961

$1.850

$1.107

$0.972

$0.901

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 293 parts In-Stock

1+ parts

$1.378

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$1.378

-

-

-

Vyrian

USA . 2,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,388

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,365 parts In-Stock

1+ parts

$1.305

100+ parts

-

1k+ parts

-

10k+ parts

-

3,365

$1.305

-

-

-

Component Stockers USA

USA . 17,297 parts In-Stock

1+ parts

$1.510

100+ parts

$1.090

1k+ parts

$0.560

10k+ parts

$0.560

17,297

$1.510

$1.090

$0.560

$0.560

Parana Technologies

USA . 838 parts In-Stock

1+ parts

$21.801

100+ parts

-

1k+ parts

$22.269

10k+ parts

-

838

$21.801

-

$22.269

-

DigiPath Technology Company

USA . 1,716 parts In-Stock

1+ parts

$24.006

100+ parts

$22.086

1k+ parts

-

10k+ parts

-

1,716

$24.006

$22.086

-

-

ChromeModa Solutions

Germany . 3,335 parts In-Stock

1+ parts

$24.496

100+ parts

$20.087

1k+ parts

-

10k+ parts

-

3,335

$24.496

$20.087

-

-

IDEA Electronic Components Group

UK . 1,667 parts In-Stock

1+ parts

$24.496

100+ parts

$23.271

1k+ parts

$22.046

10k+ parts

-

1,667

$24.496

$23.271

$22.046

-

Microchip USA

USA . 11,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,347

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,661

-

-

-

-

Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Metaverse IC Inc.

Canada . 1,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,981

-

-

-

-

Overview

Discover the innovative SN74LS51NSR by Texas Instruments, a high-quality logic gate that offers unparalleled reliability and performance. With Texas Instruments' reputation for excellence in electronic components, this product is sure to exceed your expectations. Ideal for a wide range of applications, this logic gate provides fast propagation delay and low power consumption, making it a valuable addition to any project. Experience the benefits of seamless integration and efficient operation with the SN74LS51NSR, designed to meet all your electronic needs. Upgrade to Texas Instruments today and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product resistant to impact and moisture, ensuring durability and reliability in various environmental conditions.

Propagation Delay At Nominal Supply: 20 ns

The low propagation delay of 20 ns ensures fast signal processing, making the product suitable for applications that require quick response times.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

With 2 functions in one device, it offers versatility in circuit design and reduces the need for multiple components, leading to cost-effectiveness.

No. of Inputs: 4

Having 4 inputs provides flexibility in designing complex logic operations, enabling the product to handle more intricate tasks efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard logic circuits, ensuring seamless integration into existing systems.

Load Capacitance (CL): 15 pF

The low load capacitance of 15 pF minimizes signal distortion and energy consumption, enhancing overall performance and efficiency.

Power Supplies (V): 5

Operating on a 5V power supply simplifies power management and compatibility with other components, contributing to system stability.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options, accommodating various circuit configurations and facilitating ease of use.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications with limited board real estate.

Maximum I (ol): 16 Amp

The high output current capability of 16 Amp allows the product to drive heavy loads or multiple devices, expanding its range of potential applications.

Propagation Delay (tpd): 20 ns

The consistent propagation delay of 20 ns ensures reliable and stable signal transmission, preventing timing issues and improving overall system performance.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product remains functional and reliable even in elevated environmental conditions, ensuring longevity.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures functionality in colder environments, expanding the range of applications and settings where the product can be used.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of this terminal finish provides excellent conductivity and resistance to corrosion, ensuring optimal electrical connections and long-term reliability.

Terminal Position: DUAL

The dual terminal position offers increased flexibility in PCB layout and connection options, allowing for versatile board designs and ease of assembly.

Maximum Seated Height: 2 mm

The low maximum seated height of 2 mm helps in creating slim and compact electronic devices, making the product suitable for applications with space constraints.

Width: 5.3 mm

The narrow width of 5.3 mm enables efficient space utilization on the PCB, contributing to compact and streamlined designs.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage requirement of 4.75V ensures compatibility with a wide range of power sources, making the product versatile and adaptable.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the product can withstand the soldering process during assembly without sustaining damage, ensuring robustness.

Length: 10.2 mm

The compact length of 10.2 mm contributes to the overall small form factor of the product, making it suitable for applications where space is limited.

Temperature Grade: COMMERCIAL

Designed for commercial temperature requirements, the product is suitable for a wide range of everyday applications and environments, ensuring widespread usability.

Technology: TTL

Based on TTL technology, the product offers reliable and robust logic operations with fast switching speeds, making it suitable for a variety of industrial and commercial applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates automated assembly processes and ensures secure solder joints, enhancing manufacturing efficiency and product reliability.

Packing Method: TR

The TR (Tape and Reel) packing method simplifies component handling, storage, and automatic pick-and-place assembly, streamlining production processes.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27 mm allows for high-density mounting on PCBs, enabling compact and space-efficient circuit layouts.

Maximum Supply Voltage (Vsup): 5.25 V

With a maximum supply voltage of 5.25V, the product offers a built-in safety margin, protecting against voltage spikes and ensuring stable operation within the specified range.

Maximum Power Supply Current (ICC): 2.8 mA

The low maximum power supply current of 2.8 mA reduces energy consumption and heat dissipation, contributing to overall system efficiency and reliability.

Technical Specifications

Logic Gates SN74LS51NSR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

ASYMMETRICAL I/PS

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

2.8 mA

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LS51NSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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