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SN74LS374DWRG4

Texas Instruments

SN74LS374DWRG4 by Texas Instruments

SN74LS374DWRG4 by Texas Instruments is an 8-bit bus driver with 28ns propagation delay at 5V. It features a small outline package, 3-STATE output, and positive edge trigger. Ideal for applications requiring fast signal transmission in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,828 parts In-Stock

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Chip Stock

USA . 5,270 parts In-Stock

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Digiode

USA . 4,983 parts In-Stock

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Bristol Electronics

USA . 860 parts In-Stock

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Microfarads

USA . 24 parts In-Stock

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LWI Electronics Inc

India . 19 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 794 parts In-Stock

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$9.537

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One Stop Electronics

USA . 1,102 parts In-Stock

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$15.000

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$15.000

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Parana Technologies

USA . 1,007 parts In-Stock

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$17.238

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$17.453

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$17.238

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DigiPath Technology Company

USA . 407 parts In-Stock

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$18.982

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407

$18.982

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ChromeModa Solutions

Germany . 3,294 parts In-Stock

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$19.369

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$15.883

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$19.369

$15.883

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IDEA Electronic Components Group

UK . 618 parts In-Stock

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$19.369

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$18.401

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$17.432

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618

$19.369

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$17.432

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Andel Nordic

Denmark . 578 parts In-Stock

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$74.605

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$71.620

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578

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$71.620

Microchip USA

USA . 10,382 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,964 parts In-Stock

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Corphita

USA . 3,264 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LS374DWRG4 from Texas Instruments, a top-tier manufacturer known for quality and reliability. As a versatile Bus Driver & Transceiver component, this product offers seamless integration, efficient performance, and precise signal transmission. With 8 bits and 3-STATE output characteristics, it is ideal for various applications where speed and accuracy are crucial. Trust in Texas Instruments to deliver cutting-edge technology that elevates your designs to the next level. Upgrade your projects with the SN74LS374DWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 28 ns

The low propagation delay allows for fast and efficient signal transmission, making this product ideal for high-speed data transfer applications.

Surface Mount: YES

The surface mount feature makes installation and assembly of the product easy and convenient, saving time and effort for the user.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used in many electronic systems, ensuring compatibility and ease of integration for the product.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for multi-device communication and control, adding versatility and flexibility to the product's functionality.

Technology: TTL

The use of TTL technology provides reliable and accurate signal processing, ensuring high performance and stability for the product.

Technical Specifications

Bus Driver & Transceivers SN74LS374DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74LS374DWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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