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SN74LS11DRG4

Texas Instruments

SN74LS11DRG4 by Texas Instruments

SN74LS11DRG4 by Texas Instruments is a TTL logic gate with 3 functions and inputs, operating at 5V. It has a propagation delay of 20ns, load capacitance of 15pF, and can handle a max power supply current of 6.6mA. This small outline package is ideal for commercial applications requiring fast signal processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,870 parts In-Stock

1+ parts

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4,870

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Digiode

USA . 4,195 parts In-Stock

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4,195

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 542 parts In-Stock

1+ parts

$12.326

100+ parts

-

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542

$12.326

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Parana Technologies

USA . 1,628 parts In-Stock

1+ parts

$25.016

100+ parts

-

1k+ parts

$25.705

10k+ parts

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1,628

$25.016

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$25.705

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DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

$27.546

100+ parts

$25.342

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-

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342

$27.546

$25.342

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ChromeModa Solutions

Germany . 6,841 parts In-Stock

1+ parts

$28.108

100+ parts

$23.049

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-

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6,841

$28.108

$23.049

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IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$28.108

100+ parts

$26.703

1k+ parts

$25.297

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289

$28.108

$26.703

$25.297

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One Stop Electronics

USA . 502 parts In-Stock

1+ parts

$31.000

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502

$31.000

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Microchip USA

USA . 3,467 parts In-Stock

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3,467

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Corphita

USA . 2,891 parts In-Stock

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2,891

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Overview

Upgrade your electronic projects with the SN74LS11DRG4 by Texas Instruments, a top-quality logic gate that offers reliability and precision. Manufactured by industry leader Texas Instruments, this product guarantees high performance and durability. Ideal for a wide range of applications, from computer systems to industrial automation, this logic gate boasts three functions and three inputs, making it versatile and efficient. Trust in Texas Instruments for superior quality and choose the SN74LS11DRG4 for unbeatable value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the logic gates, ensuring long-term reliability.

Propagation Delay at Nominal Supply: 20 ns

The low propagation delay of 20 ns ensures fast operation and efficient performance of the logic gates in processing input signals.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing processes.

Nominal Supply Voltage: 5V

The 5V nominal supply voltage ensures compatibility with common power sources, making integration and operation easier.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the logic gates can withstand high temperature environments, increasing their versatility.

Technology: TTL

The use of TTL technology ensures reliable performance and compatibility with other TTL components, making it a suitable choice for various digital applications.

Technical Specifications

Logic Gates SN74LS11DRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

6.6 mA

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LS11DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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