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SN74LS02DE4

Texas Instruments

SN74LS02DE4 by Texas Instruments

SN74LS02DE4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 15 ns at 5V, making it suitable for high-speed applications. This small outline package with gull wing terminals is ideal for surface mount designs in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,473 parts In-Stock

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5,473

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Digiode

USA . 2,833 parts In-Stock

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2,833

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Distributors (Availability)

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AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$5.848

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684

$5.848

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Parana Technologies

USA . 889 parts In-Stock

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$18.053

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-

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$18.199

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889

$18.053

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$18.199

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DigiPath Technology Company

USA . 1,067 parts In-Stock

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$19.878

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1,067

$19.878

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ChromeModa Solutions

Germany . 4,830 parts In-Stock

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$20.284

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$16.633

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4,830

$20.284

$16.633

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IDEA Electronic Components Group

UK . 1,854 parts In-Stock

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$20.284

100+ parts

$19.270

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$18.256

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1,854

$20.284

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$18.256

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One Stop Electronics

USA . 290 parts In-Stock

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$40.000

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290

$40.000

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Component Stockers USA

USA . 673 parts In-Stock

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$99.990

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673

$99.990

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Corphita

USA . 4,512 parts In-Stock

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Perfect Parts

USA . 1,574 parts In-Stock

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Overview

Unlock the power of reliable and efficient logic gates with the SN74LS02DE4 from Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers high-quality components that exceed expectations. This versatile logic gate is perfect for a wide range of applications, providing fast propagation delay and low power consumption. Trust in Texas Instruments to provide innovative solutions for your electronic projects, and experience the value and performance that sets this product apart.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 15 ns

The low propagation delay ensures fast signal processing, making these logic gates suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes these logic gates compatible with a wide range of electronic systems and components.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, these logic gates can withstand elevated temperatures, ensuring reliability in various environments.

Technical Specifications

Logic Gates SN74LS02DE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

5.4 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LS02DE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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