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SN74HCT373DBRG4

Texas Instruments

SN74HCT373DBRG4 by Texas Instruments

SN74HCT373DBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 44 ns at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has true output polarity. Ideal for applications requiring fast data transmission and control signal routing in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,563 parts In-Stock

1+ parts

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7,563

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Digiode

USA . 2,265 parts In-Stock

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2,265

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 935 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

$4.224

10k+ parts

$4.224

935

$4.400

-

$4.224

$4.224

One Stop Electronics

USA . 182 parts In-Stock

1+ parts

$16.000

100+ parts

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182

$16.000

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AZTECH Wire

Italy . 606 parts In-Stock

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$18.131

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606

$18.131

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Parana Technologies

USA . 2,190 parts In-Stock

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$22.259

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$22.931

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2,190

$22.259

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$22.931

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DigiPath Technology Company

USA . 1,364 parts In-Stock

1+ parts

$24.510

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1,364

$24.510

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IDEA Electronic Components Group

UK . 594 parts In-Stock

1+ parts

$25.010

100+ parts

$23.760

1k+ parts

$22.509

10k+ parts

-

594

$25.010

$23.760

$22.509

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ChromeModa Solutions

Germany . 8 parts In-Stock

1+ parts

$25.010

100+ parts

$20.508

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8

$25.010

$20.508

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Corphita

USA . 2,637 parts In-Stock

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2,637

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Microchip USA

USA . 500 parts In-Stock

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500

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Overview

Enhance the performance of your electronic systems with the SN74HCT373DBRG4 from Texas Instruments. As a top manufacturer in the industry, Texas Instruments delivers reliable and high-quality products like this 8-bit bus driver/transceiver. With a nominal supply voltage of 5V and a maximum operating temperature of 85°C, this small outline package offers fast propagation delay and 3-state output characteristics. Ideal for various applications, this versatile component ensures efficient signal transmission while providing customers with exceptional value and reliability. Upgrade your designs with the SN74HCT373DBRG4 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 44 ns

Low propagation delay ensures fast communication and response times, making the product efficient for bus driver and transceiver applications.

Surface Mount: YES

Surface mount technology makes installation easy and saves space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Compatibility with a common supply voltage of 5V makes the product widely usable and easy to integrate into existing systems.

Maximum I (ol): 6 Amp

High output current capability allows the product to drive heavy loads, making it suitable for bus driver applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74HCT373DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

65 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74HCT373DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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