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SN74HC623DWRE4

Texas Instruments

SN74HC623DWRE4 by Texas Instruments

SN74HC623DWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 26ns at 5V. It features a 3-STATE output, operates in industrial temperatures (-40 to 85 °C), and has independent control for bidirectional communication. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,198 parts In-Stock

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3,198

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Digiode

USA . 248 parts In-Stock

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248

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Distributors (Availability)

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Andel Nordic

Denmark . 326 parts In-Stock

1+ parts

$10.129

100+ parts

-

1k+ parts

$9.724

10k+ parts

$9.724

326

$10.129

-

$9.724

$9.724

AZTECH Wire

Italy . 605 parts In-Stock

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$17.516

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605

$17.516

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Parana Technologies

USA . 1,284 parts In-Stock

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$28.149

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$44.230

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1,284

$28.149

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$44.230

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DigiPath Technology Company

USA . 1,883 parts In-Stock

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$30.995

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1,883

$30.995

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$31.628

100+ parts

$30.047

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$28.465

10k+ parts

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2,267

$31.628

$30.047

$28.465

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ChromeModa Solutions

Germany . 704 parts In-Stock

1+ parts

$31.628

100+ parts

$25.935

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704

$31.628

$25.935

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One Stop Electronics

USA . 439 parts In-Stock

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$61.000

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439

$61.000

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Component Stockers USA

USA . 500 parts In-Stock

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$99.990

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500

$99.990

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Corphita

USA . 2,605 parts In-Stock

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2,605

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Microchip USA

USA . 493 parts In-Stock

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493

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Overview

Unlock the power of seamless data transmission with the SN74HC623DWRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers & transceivers that ensure reliable performance and durability. Ideal for a wide range of applications, this product offers customers unmatched value with its fast propagation delay and low power consumption. Say goodbye to connectivity issues and experience smooth operation with the SN74HC623DWRE4. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 26 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of electronic systems.

Maximum Seated Height: 2.65 mm

Low seated height allows for compact and slim designs, making this product suitable for space-constrained applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient and reliable performance.

Technical Specifications

Bus Driver & Transceivers SN74HC623DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74HC623DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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