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SN74HC368DBRE4

Texas Instruments

SN74HC368DBRE4 by Texas Instruments

SN74HC368DBRE4 by Texas Instruments is a 16-terminal bus driver with 24ns propagation delay and 150ns tpd. It operates at a voltage range of 2-6V, suitable for industrial applications requiring inverted output polarity and 3-state output characteristics. This CMOS technology device comes in a small outline package ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,885 parts In-Stock

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5,885

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Digiode

USA . 1,835 parts In-Stock

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1,835

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Distributors (Availability)

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Andel Nordic

Denmark . 4,801 parts In-Stock

1+ parts

$3.549

100+ parts

-

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$3.407

10k+ parts

$3.407

4,801

$3.549

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$3.407

$3.407

AZTECH Wire

Italy . 586 parts In-Stock

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$12.391

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586

$12.391

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Parana Technologies

USA . 1,860 parts In-Stock

1+ parts

$20.372

100+ parts

$1,891.858

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$18.335

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1,860

$20.372

$1,891.858

$18.335

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DigiPath Technology Company

USA . 1,958 parts In-Stock

1+ parts

$22.432

100+ parts

$20.638

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1,958

$22.432

$20.638

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ChromeModa Solutions

Germany . 6,100 parts In-Stock

1+ parts

$22.890

100+ parts

$18.770

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6,100

$22.890

$18.770

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IDEA Electronic Components Group

UK . 1,865 parts In-Stock

1+ parts

$22.890

100+ parts

$21.746

1k+ parts

$20.601

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1,865

$22.890

$21.746

$20.601

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One Stop Electronics

USA . 271 parts In-Stock

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$39.000

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271

$39.000

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Microchip USA

USA . 5,374 parts In-Stock

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Corphita

USA . 629 parts In-Stock

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Overview

Enhance your electronics projects with the SN74HC368DBRE4 from Texas Instruments, a leading manufacturer known for top-quality components. This bus driver and transceiver offers exceptional performance and reliability, making it perfect for a wide range of applications. With its advanced features and innovative design, this product provides unmatched value and benefits to customers, ensuring smooth operation and seamless integration into any project. Choose Texas Instruments for superior quality and performance you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for transportation applications.

Propagation Delay At Nominal Supply: 24 ns

Low propagation delay ensures fast signal transmission, improving the efficiency of the bus driver.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the PCB.

No. of Functions: 2

Having multiple functions in a single component increases the functionality and versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures proper signal transmission and reception without signal degradation.

Power Supplies (V): 2/6

Support for multiple power supply voltages adds flexibility in system design and integration.

Output Characteristics: 3-STATE

3-state output allows the bus driver to effectively control the bus lines by driving them high, low, or leaving them in a high impedance state.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74HC368DBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74HC368DBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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