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SN74HC368DBR

Texas Instruments

SN74HC368DBR by Texas Instruments

SN74HC368DBR by Texas Instruments is a 4-bit bus driver with 24ns propagation delay, suitable for industrial applications. It operates at supply voltages of 2-6V, has 16 terminals in a small outline package, and features 3-state output characteristics. Ideal for driving buses with load capacitance up to 50pF while offering inverted output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,198 parts In-Stock

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Vyrian

USA . 2,186 parts In-Stock

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Andel Nordic

Denmark . 2,283 parts In-Stock

1+ parts

$9.092

100+ parts

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$8.728

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$8.728

2,283

$9.092

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$8.728

$8.728

AZTECH Wire

Italy . 218 parts In-Stock

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$13.626

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One Stop Electronics

USA . 1,631 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,527 parts In-Stock

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$22.048

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$22.611

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$22.048

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DigiPath Technology Company

USA . 411 parts In-Stock

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$24.278

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$22.335

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411

$24.278

$22.335

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ChromeModa Solutions

Germany . 781 parts In-Stock

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$24.773

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$20.314

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IDEA Electronic Components Group

UK . 625 parts In-Stock

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$24.773

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$23.534

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$22.296

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Component Stockers USA

USA . 561 parts In-Stock

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$99.990

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Microchip USA

USA . 5,554 parts In-Stock

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Corphita

USA . 1,115 parts In-Stock

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Overview

Enhance your electronic designs with the SN74HC368DBR by Texas Instruments, a high-quality bus driver & transceiver. With a wide range of applications, this product offers reliable performance and efficient data transmission. Texas Instruments is renowned for its innovative technology and superior manufacturing standards, ensuring that you get the best value for your money. Trust in the SN74HC368DBR to deliver seamless connectivity and optimal functionality for all your electronics projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 24 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and making installation simpler.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, streamlining the overall design and reducing costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and power supplies.

Load Capacitance (CL): 50 pF

This low load capacitance ensures minimal interference and distortion in signal transmission, resulting in clear and accurate data transfer.

Power Supplies (V): 2/6

Supporting a range of power supply voltages provides flexibility in system design and compatibility with various power sources.

Maximum I (ol): 6 Amp

High output current capability allows this product to drive larger loads and handle high-power applications effectively.

Output Characteristics: 3-STATE

The 3-STATE output feature provides flexibility in controlling the output signal, allowing for tri-state logic operation and reducing power consumption.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature range (-40°C to 85°C), ensuring reliability and performance in harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers SN74HC368DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74HC368DBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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