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SN74HC240DW

Texas Instruments

SN74HC240DW by Texas Instruments

SN74HC240DW by Texas Instruments is a 4-bit bus driver with 25 ns propagation delay, 150 pF load capacitance, and 6 Amp max I (ol). It is used in industrial applications for enabling low control type with inverted output polarity.

Median Price

$0.784

Lifecycle Status

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45

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1k+

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Farnell

UK . 1,750 parts In-Stock

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$0.427

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$0.243

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$0.150

Newark

USA . 1,750 parts In-Stock

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$0.620

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$0.313

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Element14

Singapore . 1,750 parts In-Stock

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$0.949

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$0.370

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$0.315

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Mouser Electronics

USA . 258 parts In-Stock

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Rochester

USA . 35,209 parts In-Stock

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DigiKey

USA . 35,209 parts In-Stock

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Verical

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Avnet

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Distributors (In-Stock)

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Freelance Electronics

USA . 125 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Digiode

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Nova Conductors

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TEDSS.com

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Component Electronics Inc.

Canada . 105 parts In-Stock

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DigiKey Marketplace

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Mentor Electronics Marketing, LLC

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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First Choice Components Inc.

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Ashlea Components Ltd

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ComSIT Distribution GmbH

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Component Sense

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Resion

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Ampacity Inc.

Singapore . 17,598 parts In-Stock

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$0.124

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Corphita

USA . 4,739 parts In-Stock

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$0.472

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Argo Parts USA

USA . 5,159 parts In-Stock

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$0.539

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$0.523

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Continental Prestige Electronics

USA . 1,218 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Parana Technologies

USA . 745 parts In-Stock

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$7.506

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$8.012

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DigiPath Technology Company

USA . 597 parts In-Stock

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$8.265

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$7.604

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ChromeModa Solutions

Germany . 6,707 parts In-Stock

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$8.434

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$6.916

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IDEA Electronic Components Group

UK . 568 parts In-Stock

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$8.434

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$8.012

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$7.591

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Andel Nordic

Denmark . 5,461 parts In-Stock

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$10.861

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Corohmni

South Africa . 370 parts In-Stock

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$22.541

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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GreenTree Electronics

Israel . 547 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Computer Components Inc. - USA

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Overview

Enhance the efficiency and reliability of your electronic designs with the Texas Instruments SN74HC240DW bus driver & transceiver. With a reputation for superior quality and innovation, Texas Instruments delivers a product that exceeds expectations. This versatile component offers 3-STATE output characteristics, inverted output polarity, and dual terminal position for maximum flexibility. Ideal for applications requiring seamless communication between multiple devices, the SN74HC240DW boasts a compact design and low power consumption, making it a valuable addition to any tech enthusiast's toolkit. Unlock endless possibilities with Texas Instruments - where cutting-edge technology meets unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and can withstand harsh environmental conditions, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 25 ns

Fast propagation delay ensures quick transmission of signals, leading to efficient communication within the bus system.

Surface Mount: YES

Surface mount capability makes the installation process easier and more convenient, saving time and effort during the setup.

No. of Functions: 2

Having multiple functions in a single device simplifies the overall design and reduces the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility and easy integration with standard bus driver and transceiver configurations.

No. of Bits: 4

4-bit capability allows for sufficient data transmission and processing, meeting the requirements of various bus communication protocols.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and reliable operation of the bus driver and transceiver.

Load Capacitance (CL): 150 pF

Suitable load capacitance ensures proper signal integrity and noise immunity, enhancing the overall performance of the bus system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the device suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures reliable operation even in cold environments, making it versatile for different application settings.

Technical Specifications

Bus Driver & Transceivers SN74HC240DW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74HC240DW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-465-5497, 5962014655497

NIIN

014655497

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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