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SN74HC21DRG4

Texas Instruments

SN74HC21DRG4 by Texas Instruments

SN74HC21DRG4 by Texas Instruments is a logic gate with 2 functions and 4 inputs. It has a propagation delay of 28 ns at 5V, suitable for industrial applications. With a small outline package style and dual terminal position, it operates b/w -40 to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 32,210 parts In-Stock

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Vyrian

USA . 1,963 parts In-Stock

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Digiode

USA . 1,681 parts In-Stock

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PC Components Company LLC

USA . 899 parts In-Stock

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899

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Bristol Electronics

USA . 899 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Corohmni

South Africa . 662 parts In-Stock

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$8.037

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662

$8.037

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AZTECH Wire

Italy . 191 parts In-Stock

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$16.209

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Ampacity Inc.

Singapore . 1,240 parts In-Stock

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$25.000

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Parana Technologies

USA . 928 parts In-Stock

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$28.397

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$46.988

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$28.397

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ChromeModa Solutions

Germany . 5,613 parts In-Stock

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$31.907

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$26.164

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

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$31.907

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$30.312

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$28.716

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One Stop Electronics

USA . 1,480 parts In-Stock

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$44.000

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Semicontronic

India . 325 parts In-Stock

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$48.750

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Continental Prestige Electronics

USA . 4,855 parts In-Stock

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Argo Parts USA

USA . 3,638 parts In-Stock

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Corphita

USA . 3,428 parts In-Stock

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iodParts Technologies Inc.

India . 899 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 257 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience superior performance and reliability with the Texas Instruments SN74HC21DRG4 Logic Gates. Manufactured by a trusted industry leader, this product offers high-quality logic gates that are essential for a wide range of applications. With fast propagation delay, low power consumption, and a compact design, this logic gate provides exceptional value and efficiency to customers. Trust Texas Instruments for cutting-edge technology and unmatched quality in every product. Elevate your projects with the SN74HC21DRG4 Logic Gates today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protects the internal components of the logic gates, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 28 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

No. of Functions: 2

Having multiple functions in one package increases versatility and efficiency in circuit design, making this product a space-saving solution.

No. of Inputs: 4

With 4 inputs, this logic gate can handle complex logic operations, providing flexibility in designing intricate circuits.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and components, ensuring ease of integration.

Technical Specifications

Logic Gates SN74HC21DRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC21DRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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