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SN74HC21DG4

Texas Instruments

SN74HC21DG4 by Texas Instruments

SN74HC21DG4 by Texas Instruments is a logic gate with 2 functions and 4 inputs. It has a propagation delay of 28 ns and operates at a nominal voltage of 5V. This IC is commonly used in industrial applications due to its small outline package and wide temperature range.

Median Price

$0.922

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 219 parts In-Stock

1+ parts

$1.110

100+ parts

$0.768

1k+ parts

$0.501

10k+ parts

$0.427

219

$1.110

$0.768

$0.501

$0.427

Rochester

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$0.735

1k+ parts

$0.610

10k+ parts

$0.544

150

-

$0.735

$0.610

$0.544

Distributors (In-Stock)

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Digiode

USA . 4,694 parts In-Stock

1+ parts

$0.437

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4,694

$0.437

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Nova Conductors

Japan . 15 parts In-Stock

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$0.526

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15

$0.526

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Chip Stock

USA . 32,640 parts In-Stock

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32,640

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Vyrian

USA . 6,404 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 185 parts In-Stock

1+ parts

$0.391

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-

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185

$0.391

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Semicontronic

India . 185 parts In-Stock

1+ parts

$0.391

100+ parts

$0.381

1k+ parts

$0.379

10k+ parts

-

185

$0.391

$0.381

$0.379

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Corphita

USA . 4,764 parts In-Stock

1+ parts

$0.414

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-

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4,764

$0.414

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.515

100+ parts

-

1k+ parts

$0.495

10k+ parts

-

1,000

$0.515

-

$0.495

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Corohmni

South Africa . 501 parts In-Stock

1+ parts

$0.526

100+ parts

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501

$0.526

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Argo Parts USA

USA . 4,990 parts In-Stock

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$0.526

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-

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$0.510

4,990

$0.526

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-

$0.510

Continental Prestige Electronics

USA . 3,205 parts In-Stock

1+ parts

$0.526

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$0.515

3,205

$0.526

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$0.515

AZTECH Wire

Italy . 702 parts In-Stock

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$15.600

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702

$15.600

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Parana Technologies

USA . 1,705 parts In-Stock

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$26.724

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$27.812

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1,705

$26.724

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$27.812

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DigiPath Technology Company

USA . 525 parts In-Stock

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$29.426

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525

$29.426

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ChromeModa Solutions

Germany . 4,862 parts In-Stock

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$30.027

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$24.622

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4,862

$30.027

$24.622

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IDEA Electronic Components Group

UK . 1,073 parts In-Stock

1+ parts

$30.027

100+ parts

$28.526

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$27.024

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1,073

$30.027

$28.526

$27.024

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Perfect Parts

USA . 2,744 parts In-Stock

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Microchip USA

USA . 2,509 parts In-Stock

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Overview

Looking for a high-quality logic gate that offers exceptional performance? Look no further than the SN74HC21DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments is known for delivering top-notch products, and this logic gate is no exception. With its compact design and surface mount capability, it offers convenience and versatility. Whether you're working on a complex circuit or a simple project, the SN74HC21DG4 provides reliable functionality with its 2 functions and 4 inputs. Its low propagation delay ensures efficient operation, while its wide temperature range makes it suitable for industrial applications. Trust Texas Instruments to bring you the value, benefits, and advantages you need in a logic gate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this logic gate durable and able to withstand harsh operating conditions.

Propagation Delay At Nominal Supply: 28 ns

With a fast propagation delay of 28 ns, this logic gate ensures quick and efficient signal transmission, making it ideal for time-sensitive applications.

Surface Mount: YES

The surface mount capability of this logic gate simplifies the PCB assembly process, making it a convenient choice for automated manufacturing.

No. of Functions: 2

With two built-in logical functions, this logic gate offers versatility and can perform a wider range of tasks, providing added value to the user.

No. of Inputs: 4

The availability of four inputs enables this logic gate to process multiple signals simultaneously, enhancing its capability and efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs, optimizing board space and facilitating compact system designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this logic gate is compatible with standard electronic systems, ensuring seamless integration.

Load Capacitance (CL): 50 pF

The ability to handle a load capacitance of 50 pF makes this logic gate suitable for driving capacitive loads, expanding its application range.

Power Supplies (V): 2/6

Supporting power supplies of 2V and 6V, this logic gate can operate in different voltage environments, providing flexibility in system design.

No. of Terminals: 14

With 14 terminals, this logic gate offers ample connection options, accommodating various input and output configurations for versatile use.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it easy to integrate this logic gate into densely populated circuit boards, optimizing space utilization.

Maximum I (ol): 5.2 Amp

With a maximum output current of 5.2 Amps, this logic gate can drive higher loads, making it suitable for demanding applications.

Propagation Delay (tpd): 140 ns

The propagation delay of 140 ns ensures reliable and accurate signal transmission, making this logic gate suitable for precision applications.

Maximum Operating Temperature: 85 °C

This logic gate can operate reliably in high-temperature environments up to 85°C, ensuring robust performance in demanding conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate can withstand extreme cold temperatures, making it suitable for diverse environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold enhances the contact reliability and corrosion resistance of this logic gate, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layout and easier soldering, facilitating efficient assembly and reducing production time.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this logic gate offers a low profile, enabling compact designs and efficient use of vertical space.

Width: 3.9 mm

The narrow width of 3.9 mm contributes to space efficiency, making this logic gate suitable for compact electronic devices and miniaturized applications.

Minimum Supply Voltage (Vsup): 2V

Operating at a minimum supply voltage of 2V, this logic gate provides compatibility with low-power applications, conserving energy and extending battery life.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate can withstand high-temperature reflow soldering processes, facilitating reliable assembly.

Length: 8.65 mm

The length of 8.65 mm ensures a compact footprint, allowing for efficient use of PCB space and enabling the design of smaller systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this logic gate can operate reliably in demanding environmental conditions, making it suitable for ruggedized systems.

Technology: CMOS

Built using complementary metal-oxide-semiconductor (CMOS) technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull-wing terminal form enables easy soldering and robust mechanical connections, enhancing the reliability and durability of this logic gate.

Packing Method: TUBE

Packaged in tubes, this logic gate offers convenient handling, storage, and protection during transit, simplifying inventory management and ensuring product integrity.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this logic gate aligns easily with standard PCB footprints and allows for precise connections, facilitating reliable board-level integration.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 indicates that this logic gate has a low susceptibility to moisture-related failures, ensuring its reliability in humid environments.

Maximum Supply Voltage (Vsup): 6V

Operating within a maximum supply voltage of 6V, this logic gate offers flexibility and compatibility with a wide range of electronic systems, expanding its potential applications.

Maximum Power Supply Current (ICC): 0.02 mA

With a maximum power supply current of 0.02 mA, this logic gate ensures efficient power management and low power consumption, making it suitable for battery-powered devices.

Technical Specifications

Logic Gates SN74HC21DG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC21DG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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