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SN74HC03DG4

Texas Instruments

SN74HC03DG4 by Texas Instruments

SN74HC03DG4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 31 ns at 5V, making it suitable for industrial applications requiring fast response times. With open-drain output characteristics and a small outline package style, it is ideal for surface mount designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,643 parts In-Stock

1+ parts

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6,643

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Digiode

USA . 2,527 parts In-Stock

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2,527

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Distributors (Availability)

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One Stop Electronics

USA . 590 parts In-Stock

1+ parts

$10.000

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-

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590

$10.000

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AZTECH Wire

Italy . 652 parts In-Stock

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$16.700

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652

$16.700

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Parana Technologies

USA . 150 parts In-Stock

1+ parts

$24.027

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$24.686

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150

$24.027

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$24.686

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DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

$26.457

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1,752

$26.457

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ChromeModa Solutions

Germany . 5,580 parts In-Stock

1+ parts

$26.997

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$22.138

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5,580

$26.997

$22.138

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IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$26.997

100+ parts

$25.647

1k+ parts

$24.297

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-

1,500

$26.997

$25.647

$24.297

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Component Stockers USA

USA . 457 parts In-Stock

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$99.990

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457

$99.990

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Corphita

USA . 4,832 parts In-Stock

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Microchip USA

USA . 4,404 parts In-Stock

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4,404

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Overview

Enhance your electronic projects with the cutting-edge SN74HC03DG4 logic gate by Texas Instruments. With a reputation for top-quality products, TI delivers unparalleled performance and reliability in the field of logic gates. This versatile component is perfect for a wide range of applications, offering fast propagation delay and low power consumption. Trust in Texas Instruments to provide the value and innovation you need to take your designs to the next level. Upgrade your circuits today with the SN74HC03DG4 and experience the difference that TI can make for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Propagation Delay At Nominal Supply: 31 ns

With a low propagation delay, this logic gate offers high-speed operation, making it suitable for applications that require quick response times.

Surface Mount: YES

Being surface mountable, this logic gate can be easily integrated into compact circuit designs, saving space and simplifying assembly.

No. of Functions: 4

With multiple functions in a single component, this logic gate offers versatility and efficiency in circuit design, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V, this logic gate is compatible with many electronic systems, providing ease of integration and flexibility in design.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this logic gate is suitable for harsh environments and industrial applications where temperature fluctuations are common.

Technology: CMOS

Using CMOS technology, this logic gate offers low power consumption and high noise immunity, making it energy-efficient and reliable in noise-prone environments.

Technical Specifications

Logic Gates SN74HC03DG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

131 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC03DG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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