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SN74GTLPH1645ZQLR

Texas Instruments

SN74GTLPH1645ZQLR by Texas Instruments

SN74GTLPH1645ZQLR by Texas Instruments is a 2-function bus driver & transceiver with GTL/P & LVTTL translation. It operates at a nominal voltage of 3.3V, has a propagation delay of 8.4ns, and supports industrial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,522 parts In-Stock

1+ parts

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6,522

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Digiode

USA . 4,843 parts In-Stock

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4,843

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Distributors (Availability)

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Andel Nordic

Denmark . 2,027 parts In-Stock

1+ parts

$5.339

100+ parts

-

1k+ parts

$5.126

10k+ parts

$5.126

2,027

$5.339

-

$5.126

$5.126

AZTECH Wire

Italy . 628 parts In-Stock

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$11.436

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628

$11.436

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Parana Technologies

USA . 623 parts In-Stock

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$22.575

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$23.235

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623

$22.575

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$23.235

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ChromeModa Solutions

Germany . 4,416 parts In-Stock

1+ parts

$25.365

100+ parts

$20.799

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4,416

$25.365

$20.799

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IDEA Electronic Components Group

UK . 490 parts In-Stock

1+ parts

$25.365

100+ parts

$24.097

1k+ parts

$22.828

10k+ parts

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490

$25.365

$24.097

$22.828

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One Stop Electronics

USA . 780 parts In-Stock

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$52.000

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780

$52.000

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DigiPath Technology Company

USA . 667 parts In-Stock

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$22.869

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667

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$22.869

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Microchip USA

USA . 494 parts In-Stock

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494

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Corphita

USA . 114 parts In-Stock

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Overview

Enhance your electronic designs with the SN74GTLPH1645ZQLR by Texas Instruments, a high-quality bus driver and transceiver that offers unmatched reliability and performance. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications. With its advanced technology and precision engineering, the SN74GTLPH1645ZQLR delivers exceptional value, providing customers with seamless operation, efficient power management, and superior signal transmission. Upgrade your projects today with this cutting-edge solution and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and allows for a lightweight design, making the product easy to handle and install.

Surface Mount: YES

Surface mount technology allows for compact placement on circuit boards, saving space and enabling efficient electronic designs.

No. of Functions: 2

Having multiple functions in one component simplifies circuit design and integration, reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and fits well with standard PCB layouts, making it easy to incorporate into existing designs.

No. of Bits: 8

Having 8 bits allows for the processing and transmission of data with higher precision and accuracy.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common voltage level of 3.3V ensures compatibility with a wide range of electronic systems.

Propagation Delay (tpd): 8.4 ns

A low propagation delay ensures quick response times, making the product suitable for high-speed data transmission applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function reliably in extreme environmental conditions, making it suitable for various applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the product can withstand harsh industrial environments and operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74GTLPH1645ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

100 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTL/P & LVTTL

Width:

4.5 mm

Trade Compliance

SN74GTLPH1645ZQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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