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SN74CBTLV3245AGQNR

Texas Instruments

SN74CBTLV3245AGQNR by Texas Instruments

SN74CBTLV3245AGQNR by Texas Instruments is an 8-bit bus driver with a propagation delay of 0.25 ns. It operates at a nominal voltage of 2.5 V and supports power supplies of 2.5/3.3 V, making it ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,233 parts In-Stock

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5,233

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Digiode

USA . 4,528 parts In-Stock

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4,528

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Distributors (Availability)

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AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$7.554

100+ parts

-

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263

$7.554

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Parana Technologies

USA . 283 parts In-Stock

1+ parts

$15.507

100+ parts

$1,440.094

1k+ parts

$13.957

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283

$15.507

$1,440.094

$13.957

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DigiPath Technology Company

USA . 1,225 parts In-Stock

1+ parts

$17.076

100+ parts

$15.709

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1,225

$17.076

$15.709

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ChromeModa Solutions

Germany . 4,032 parts In-Stock

1+ parts

$17.424

100+ parts

$14.288

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4,032

$17.424

$14.288

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IDEA Electronic Components Group

UK . 1,772 parts In-Stock

1+ parts

$17.424

100+ parts

$16.553

1k+ parts

$15.682

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1,772

$17.424

$16.553

$15.682

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One Stop Electronics

USA . 1,617 parts In-Stock

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$62.000

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1,617

$62.000

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Microchip USA

USA . 298 parts In-Stock

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298

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Andel Nordic

Denmark . 153 parts In-Stock

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Corphita

USA . 119 parts In-Stock

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Overview

Unlock seamless data transmission with the SN74CBTLV3245AGQNR by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures smooth communication between devices. Experience the value of efficiency and precision with Texas Instruments, setting new standards in the industry. Elevate your projects with the innovative features and benefits of the SN74CBTLV3245AGQNR, a game-changer in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to impact, making the product suitable for rough usage environments.

Surface Mount: YES

Ease of installation and compact design for efficient use of space on a PCB.

No. of Bits: 8

Ideal for applications requiring handling of 8-bit data signals.

Nominal Supply Voltage / Vsup (V): 2.5

Efficient power utilization at 2.5V, suitable for low-power applications.

Maximum Operating Temperature: 85 °C

Ability to operate in high temperature environments, ensuring product reliability.

Output Characteristics: 3-STATE

Supports tristate logic, enabling multiple devices to share a common bus line without interference.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers SN74CBTLV3245AGQNR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBTLV/3B

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e0

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

240

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

SN74CBTLV3245AGQNR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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