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SN74CBTK32245ZKER

Texas Instruments

SN74CBTK32245ZKER by Texas Instruments

SN74CBTK32245ZKER by Texas Instruments is an 8-bit bus driver with 32 functions, 0.25 ns propagation delay, and 3-STATE output characteristics. It is ideal for bidirectional control applications in industrial settings due to its low profile grid array package style and operating temperature range of -40 to 85°C.

Median Price

$3.430

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$3.430

100+ parts

$3.360

1k+ parts

$3.290

10k+ parts

-

2,000

$3.430

$3.360

$3.290

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,219 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

-

10k+ parts

-

4,219

$3.258

-

-

-

Vyrian

USA . 3,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,512

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,870 parts In-Stock

1+ parts

$3.087

100+ parts

-

1k+ parts

-

10k+ parts

-

4,870

$3.087

-

-

-

AZTECH Wire

Italy . 636 parts In-Stock

1+ parts

$10.480

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$10.480

-

-

-

Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

$16.848

100+ parts

-

1k+ parts

$17.092

10k+ parts

-

1,922

$16.848

-

$17.092

-

DigiPath Technology Company

USA . 443 parts In-Stock

1+ parts

$18.551

100+ parts

-

1k+ parts

-

10k+ parts

-

443

$18.551

-

-

-

ChromeModa Solutions

Germany . 3,538 parts In-Stock

1+ parts

$18.930

100+ parts

$15.523

1k+ parts

-

10k+ parts

-

3,538

$18.930

$15.523

-

-

IDEA Electronic Components Group

UK . 1,538 parts In-Stock

1+ parts

$18.930

100+ parts

$17.984

1k+ parts

$17.037

10k+ parts

-

1,538

$18.930

$17.984

$17.037

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Andel Nordic

Denmark . 2,889 parts In-Stock

1+ parts

-

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2,889

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Microchip USA

USA . 464 parts In-Stock

1+ parts

-

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464

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Kepictronics

USA . 46 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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46

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Overview

Unlock the potential of your electronic devices with the SN74CBTK32245ZKER by Texas Instruments. Manufactured with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless communication between components, ensuring smooth operation and efficiency. Experience the value and benefits of Texas Instruments quality with the SN74CBTK32245ZKER, a must-have for any technology enthusiast looking to take their projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the product, making it reliable for long-term use.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication systems.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making assembly more efficient.

No. of Functions: 32

Having multiple functions in a single device offers versatility and capability to handle various tasks effectively.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and power sources.

No. of Bits: 8

An 8-bit interface allows for precise data transmission and processing, enhancing the overall performance of the product.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and compatibility with standard logic levels, making integration easier.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance between bipolar and CMOS characteristics, providing high speed, low power consumption, and robust performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended usage without performance degradation.

Technical Specifications

Bus Driver & Transceivers SN74CBTK32245ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

32

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.06 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74CBTK32245ZKER Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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