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SN74CBT6800CDBQRG4

Texas Instruments

SN74CBT6800CDBQRG4 by Texas Instruments

SN74CBT6800CDBQRG4 by Texas Instruments is a 10-bit bus driver with 3-STATE output, operating at a supply voltage of 5V. It has a propagation delay of 0.24ns and can withstand temperatures from -40 to 85°C. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,161 parts In-Stock

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Digiode

USA . 421 parts In-Stock

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One Stop Electronics

USA . 1,120 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 875 parts In-Stock

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$12.742

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Parana Technologies

USA . 1,434 parts In-Stock

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$14.932

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$15.355

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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$16.442

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$16.442

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ChromeModa Solutions

Germany . 2,242 parts In-Stock

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$16.778

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$13.758

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$16.778

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IDEA Electronic Components Group

UK . 236 parts In-Stock

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$16.778

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$15.939

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$15.100

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236

$16.778

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Component Stockers USA

USA . 532 parts In-Stock

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$99.990

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Corphita

USA . 3,277 parts In-Stock

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Andel Nordic

Denmark . 2,305 parts In-Stock

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Microchip USA

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Overview

Unlock seamless communication and data transfer with the SN74CBT6800CDBQRG4 by Texas Instruments. With a reputation for excellence in manufacturing, this bus driver and transceiver offers unmatched quality and reliability. Perfect for a wide range of applications, this innovative product boasts a 3-STATE output characteristic, true output polarity, and a compact design for easy integration. Experience fast propagation delays, dual terminal positions, and a wide temperature range for industrial use. Elevate your projects with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 10

With 10 bits, this bus driver & transceiver can handle a wide range of data and provide accurate signal transmission.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with various electronic systems and circuits.

Propagation Delay (tpd): 0.24 ns

Low propagation delay ensures fast and efficient signal transmission, reducing latency in data transfer.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance allows this product to operate effectively in harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver & transceiver energy-efficient and reliable for data transmission.

Technical Specifications

Bus Driver & Transceivers SN74CBT6800CDBQRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.24 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74CBT6800CDBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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