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SN74CBT3383CDBRE4

Texas Instruments

SN74CBT3383CDBRE4 by Texas Instruments

SN74CBT3383CDBRE4 by Texas Instruments is a 5-function bus driver with 2 bits, operating at a supply voltage of 5V. It features a propagation delay of 0.24ns and supports industrial temperature grades. This IC is ideal for applications requiring true output polarity and 3-state output characteristics in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,748 parts In-Stock

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Digiode

USA . 1,123 parts In-Stock

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1,123

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Distributors (Availability)

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Andel Nordic

Denmark . 112 parts In-Stock

1+ parts

$6.343

100+ parts

-

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$6.089

10k+ parts

$6.089

112

$6.343

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$6.089

$6.089

AZTECH Wire

Italy . 384 parts In-Stock

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$18.185

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384

$18.185

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Parana Technologies

USA . 1,888 parts In-Stock

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$23.106

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$23.746

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1,888

$23.106

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$23.746

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DigiPath Technology Company

USA . 1,331 parts In-Stock

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$25.443

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1,331

$25.443

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ChromeModa Solutions

Germany . 5,485 parts In-Stock

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$25.962

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$21.289

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5,485

$25.962

$21.289

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IDEA Electronic Components Group

UK . 1,684 parts In-Stock

1+ parts

$25.962

100+ parts

$24.664

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$23.366

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1,684

$25.962

$24.664

$23.366

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One Stop Electronics

USA . 658 parts In-Stock

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$27.000

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658

$27.000

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Microchip USA

USA . 5,104 parts In-Stock

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Corphita

USA . 493 parts In-Stock

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493

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Overview

Unleash the power of seamless data transmission with the SN74CBT3383CDBRE4 by Texas Instruments. This innovative bus driver and transceiver boasts unparalleled quality and reliability, making it a top choice for applications requiring precision and speed. With its 3-state output characteristics and true output polarity, this small outline, shrink pitch package offers customers a versatile solution for their electronic projects. Experience the benefits of faster propagation delay, dual terminal positions, and industrial-grade temperature tolerance. Elevate your designs with Texas Instruments' cutting-edge technology and unlock endless possibilities with the SN74CBT3383CDBRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost during production.

No. of Functions: 5

Having multiple functions in a single component enhances functionality and reduces the need for additional components, saving space and simplifying design.

Propagation Delay (tpd): 0.24 ns

The low propagation delay ensures quick signal transmission, making the product suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74CBT3383CDBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G24

Length:

8.2 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

5

No. of Ports:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

.24 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74CBT3383CDBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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