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SN74CBT3306DRG4

Texas Instruments

SN74CBT3306DRG4 by Texas Instruments

SN74CBT3306DRG4 by Texas Instruments is a 2-function bus driver with 3-STATE output characteristics. It operates at a nominal voltage of 5V and has a propagation delay of 0.35 ns. This CMOS technology device is ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,879 parts In-Stock

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Digiode

USA . 765 parts In-Stock

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PC Components Company LLC

USA . 65 parts In-Stock

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65

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Bristol Electronics

USA . 65 parts In-Stock

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65

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Andel Nordic

Denmark . 1,057 parts In-Stock

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$5.930

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$5.693

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$5.693

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$5.693

AZTECH Wire

Italy . 492 parts In-Stock

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$10.554

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Parana Technologies

USA . 1,687 parts In-Stock

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$19.619

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$1,821.937

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$17.657

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1,687

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$1,821.937

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DigiPath Technology Company

USA . 1,809 parts In-Stock

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$21.603

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$19.875

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ChromeModa Solutions

Germany . 6,358 parts In-Stock

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$22.044

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$18.076

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$22.044

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IDEA Electronic Components Group

UK . 746 parts In-Stock

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$22.044

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$20.942

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$19.840

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746

$22.044

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One Stop Electronics

USA . 1,408 parts In-Stock

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$34.000

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Microchip USA

USA . 4,516 parts In-Stock

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Corphita

USA . 3,487 parts In-Stock

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Overview

Unlock seamless data transmission with the Texas Instruments SN74CBT3306DRG4 Bus Driver & Transceivers. Crafted with precision and expertise, this high-quality product offers unparalleled reliability and performance. From industrial automation to telecommunications, this versatile component caters to a wide range of applications with ease. Experience the value of swift propagation delay, true output polarity, and 3-state output characteristics. Elevate your projects with the superior technology and innovative design of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and transportation.

Surface Mount: YES

Allows for easy installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Optimal supply voltage for efficient performance.

Propagation Delay (tpd): 0.35 ns

Fast signal propagation for quick response times.

Output Characteristics: 3-STATE

Allows for high impedance when not actively transmitting data.

Technology: CMOS

Complementary metal-oxide-semiconductor technology for low power consumption.

Temperature Grade: INDUSTRIAL

Suitable for industrial temperature environments.

Technical Specifications

Bus Driver & Transceivers SN74CBT3306DRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74CBT3306DRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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