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SN74CBT3253DBQRG4

Texas Instruments

SN74CBT3253DBQRG4 by Texas Instruments

SN74CBT3253DBQRG4 by Texas Instruments is a 2-function multiplexer with 16 terminals and a supply voltage of 5V. It features a propagation delay of 0.35ns, operates in industrial temperatures (-40 to 85°C), and has 4 outputs. Ideal for applications requiring fast switching b/w multiple input/output signals in compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,411 parts In-Stock

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Digiode

USA . 3,244 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Ampacity Inc.

Singapore . 855 parts In-Stock

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$6.000

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One Stop Electronics

USA . 300 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 454 parts In-Stock

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$12.373

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Parana Technologies

USA . 203 parts In-Stock

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$25.767

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$26.371

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DigiPath Technology Company

USA . 1,124 parts In-Stock

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$28.373

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IDEA Electronic Components Group

UK . 2,133 parts In-Stock

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$28.952

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$27.504

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$26.057

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ChromeModa Solutions

Germany . 1,635 parts In-Stock

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$28.952

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$23.741

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Corphita

USA . 1,258 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Microchip USA

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Overview

Unlock the power of seamless signal routing with the SN74CBT3253DBQRG4 by Texas Instruments, a versatile multiplexer & demultiplexer designed for precision and reliability. Crafted from high-quality materials and cutting-edge technology, this small outline package offers 2 functions in a compact design, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional performance with minimal power consumption, ensuring seamless integration and enhanced functionality. Experience the Texas Instruments advantage with the SN74CBT3253DBQRG4 - where quality meets innovation for superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and good protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 2

Can handle multiple input and output signals, making it versatile for various applications.

Propagation Delay (tpd): 0.35 ns

Provides fast signal processing and reduces latency, ensuring efficient data transmission.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without performance degradation, suitable for industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the overall efficiency of the multiplexer/demultiplexer.

Technical Specifications

Multiplexer & Demultiplexer SN74CBT3253DBQRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE MUX/DMUX SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74CBT3253DBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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