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SN74CBT16210DGGR

Texas Instruments

SN74CBT16210DGGR by Texas Instruments

SN74CBT16210DGGR by Texas Instruments is a 20-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has a load capacitance of 50 pF. This CMOS technology transceiver features dual terminal position and true output polarity.

Median Price

$0.369

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

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1

$0.185

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Mouser Electronics

USA . 473 parts In-Stock

1+ parts

$3.590

100+ parts

$1.960

1k+ parts

$1.330

10k+ parts

$1.230

473

$3.590

$1.960

$1.330

$1.230

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.369

10k+ parts

-

1

-

-

$0.369

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,052 parts In-Stock

1+ parts

$0.347

100+ parts

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4,052

$0.347

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Vyrian

USA . 8,441 parts In-Stock

1+ parts

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8,441

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ACDS - Activité Composants Distribution Service

France . 1,223 parts In-Stock

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1,223

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 596 parts In-Stock

1+ parts

$0.150

100+ parts

$2.000

1k+ parts

-

10k+ parts

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596

$0.150

$2.000

-

-

Corphita

USA . 4,138 parts In-Stock

1+ parts

$0.328

100+ parts

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4,138

$0.328

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Ampacity Inc.

Singapore . 103 parts In-Stock

1+ parts

$0.342

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103

$0.342

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Parana Technologies

USA . 942 parts In-Stock

1+ parts

$7.393

100+ parts

$686.574

1k+ parts

$6.654

10k+ parts

-

942

$7.393

$686.574

$6.654

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DigiPath Technology Company

USA . 1,474 parts In-Stock

1+ parts

$8.141

100+ parts

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1,474

$8.141

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IDEA Electronic Components Group

UK . 2,277 parts In-Stock

1+ parts

$8.307

100+ parts

$7.892

1k+ parts

$7.476

10k+ parts

-

2,277

$8.307

$7.892

$7.476

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ChromeModa Solutions

Germany . 1,357 parts In-Stock

1+ parts

$8.307

100+ parts

$6.812

1k+ parts

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1,357

$8.307

$6.812

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Andel Nordic

Denmark . 245 parts In-Stock

1+ parts

$9.512

100+ parts

-

1k+ parts

$9.131

10k+ parts

$9.131

245

$9.512

-

$9.131

$9.131

Microchip USA

USA . 2,566 parts In-Stock

1+ parts

$64.630

100+ parts

$63.500

1k+ parts

$62.940

10k+ parts

$62.380

2,566

$64.630

$63.500

$62.940

$62.380

Perfect Parts

USA . 8,383 parts In-Stock

1+ parts

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8,383

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Futuretech Components

Singapore . 930 parts In-Stock

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930

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Overview

Enhance your electronic projects with the SN74CBT16210DGGR by Texas Instruments, a top-tier manufacturer known for quality products in the Bus Driver & Transceivers category. This versatile component offers 20 functions and 10 bits, making it perfect for a wide range of applications. With a fast propagation delay of 0.25 ns and true output polarity, this product ensures high performance and reliability. Invest in Texas Instruments' expertise and innovation to elevate your designs and experience seamless integration with a compact package style. Upgrade your projects with the SN74CBT16210DGGR today and enjoy unparalleled value and benefits!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for use in various applications.

Propagation Delay At Nominal Supply: 0.25 ns

The low propagation delay ensures fast and efficient performance of the bus driver & transceiver, making it suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the product on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

With a standard nominal supply voltage of 5V, this product can be easily integrated into existing systems without requiring additional power supply modifications.

Output Characteristics: 3-STATE

The 3-state output feature provides flexibility in managing the output signals, allowing for efficient control and management of signal transmission.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers SN74CBT16210DGGR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL-COMPATIBLE BUS SWITCH

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

20

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

SN74CBT16210DGGR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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