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SN74CB3T3383PWR

Texas Instruments

SN74CB3T3383PWR by Texas Instruments

SN74CB3T3383PWR by Texas Instruments is a 2-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at 2.5V nominal voltage and supports bidirectional count direction. With a small outline package style and surface mount capability, it offers true output polarity and 3-state characteristics.

Median Price

$0.768

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$0.530

100+ parts

$0.520

1k+ parts

$0.510

10k+ parts

-

2,000

$0.530

$0.520

$0.510

-

Texas Instruments

USA . 28,120 parts In-Stock

1+ parts

$0.939

100+ parts

$0.722

1k+ parts

$0.380

10k+ parts

-

28,120

$0.939

$0.722

$0.380

-

Mouser Electronics

USA . 1,850 parts In-Stock

1+ parts

$1.240

100+ parts

$1.090

1k+ parts

$0.775

10k+ parts

$0.688

1,850

$1.240

$1.090

$0.775

$0.688

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.597

2,000

-

-

-

$0.597

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,232 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

$0.504

-

-

-

Vyrian

USA . 5,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,287

-

-

-

-

Chip Stock

USA . 3,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,045

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,904 parts In-Stock

1+ parts

$0.451

100+ parts

-

1k+ parts

-

10k+ parts

-

7,904

$0.451

-

-

-

Corphita

USA . 4,584 parts In-Stock

1+ parts

$0.477

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

$0.477

-

-

-

Andel Nordic

Denmark . 2,667 parts In-Stock

1+ parts

$7.350

100+ parts

-

1k+ parts

$7.056

10k+ parts

$7.056

2,667

$7.350

-

$7.056

$7.056

Parana Technologies

USA . 2,240 parts In-Stock

1+ parts

$20.609

100+ parts

-

1k+ parts

$20.708

10k+ parts

-

2,240

$20.609

-

$20.708

-

DigiPath Technology Company

USA . 164 parts In-Stock

1+ parts

$22.693

100+ parts

$20.877

1k+ parts

-

10k+ parts

-

164

$22.693

$20.877

-

-

ChromeModa Solutions

Germany . 3,971 parts In-Stock

1+ parts

$23.156

100+ parts

$18.988

1k+ parts

-

10k+ parts

-

3,971

$23.156

$18.988

-

-

IDEA Electronic Components Group

UK . 1,865 parts In-Stock

1+ parts

$23.156

100+ parts

$21.998

1k+ parts

$20.840

10k+ parts

-

1,865

$23.156

$21.998

$20.840

-

Perfect Parts

USA . 7,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,794

-

-

-

-

Overview

Unlock seamless communication and data transfer with the SN74CB3T3383PWR by Texas Instruments. As a top-tier manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in its Bus Driver & Transceivers category. This innovative product offers lightning-fast propagation delay at nominal supply, ensuring efficient performance in various applications. With a compact package style and 3-state output characteristics, the SN74CB3T3383PWR provides customers with a versatile solution for their connectivity needs. Experience the value and benefits of this high-performance device and elevate your projects to new heights. Trust Texas Instruments to deliver cutting-edge technology that empowers your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product resistant to damage and easy to handle.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage ensures reliable operation of the product, making it suitable for various electronic systems.

No. of Functions: 5

Multiple functions in a single component provide versatility and efficiency in circuit design.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enhancing flexibility in connecting multiple devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74CB3T3383PWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3T/3VT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

5

No. of Ports:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74CB3T3383PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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