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SN74CB3Q32245ZKER

Texas Instruments

SN74CB3Q32245ZKER by Texas Instruments

SN74CB3Q32245ZKER by Texas Instruments is a 32-bit bus driver & transceiver with a propagation delay of 0.3 ns. It operates at a nominal voltage of 2.5V and has a max operating temperature of 85°C. This device is commonly used in industrial applications requiring bidirectional control with low enable signal.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,660 parts In-Stock

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Vyrian

USA . 1,355 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Andel Nordic

Denmark . 4,193 parts In-Stock

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$2.966

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$2.848

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$2.848

4,193

$2.966

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$2.848

$2.848

AZTECH Wire

Italy . 422 parts In-Stock

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$11.809

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422

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Parana Technologies

USA . 80 parts In-Stock

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$29.443

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$2,734.227

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$26.499

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80

$29.443

$2,734.227

$26.499

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DigiPath Technology Company

USA . 1,549 parts In-Stock

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$32.420

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$32.420

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ChromeModa Solutions

Germany . 3,614 parts In-Stock

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$33.082

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$27.127

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3,614

$33.082

$27.127

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IDEA Electronic Components Group

UK . 1,929 parts In-Stock

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$33.082

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$31.428

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$29.774

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1,929

$33.082

$31.428

$29.774

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Ampacity Inc.

Singapore . 365 parts In-Stock

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$37.000

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365

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One Stop Electronics

USA . 749 parts In-Stock

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$63.000

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Kepictronics

USA . 2,312 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,510 parts In-Stock

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Futuretech Components

Singapore . 879 parts In-Stock

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Microchip USA

USA . 457 parts In-Stock

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iodParts Technologies Inc.

India . 5 parts In-Stock

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Overview

Discover the SN74CB3Q32245ZKER by Texas Instruments, a high-quality Bus Driver & Transceiver that offers unmatched performance and reliability. With its advanced CMOS technology, this product delivers fast propagation delay of just 0.3 ns, ensuring seamless data transmission. Whether you need to drive bus lines or interface different voltage levels, this versatile device with 32 functions has got you covered. Its compact rectangular package and low profile make it suitable for various applications. With Texas Instruments' reputation for excellence, you can trust in the exceptional value, benefits, and advantages this product brings to your projects. Upgrade your designs today with the SN74CB3Q32245ZKER!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making the product resistant to impact and temperature variations.

Propagation Delay At Nominal Supply: 0.3 ns

With a low propagation delay, this product ensures fast and efficient data transmission, reducing latency and enhancing overall performance.

Surface Mount: YES

Being surface mountable makes installation and assembly of this product convenient and hassle-free, saving time and effort.

No. of Functions: 32

With a high number of functions, this product offers versatility and flexibility in various applications, making it suitable for complex system requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy integration into different designs or equipment.

No. of Bits: 8

This product supports a wide range of data processing and communication tasks, providing reliable and accurate results in various digital applications.

Translation: N/A

Although translation is not applicable to this product, it offers direct and efficient communication between different devices or components.

Nominal Supply Voltage / Vsup (V): 2.5

With a stable and suitable nominal supply voltage of 2.5V, this product ensures consistent and reliable operation within the specified design parameters.

Power Supplies (V): 2.5/3.3

This product supports multiple power supply options, providing compatibility and versatility in various system configurations.

No. of Terminals: 96

With a high number of terminals, this product allows for easy and efficient connectivity, enabling seamless integration into complex circuitry or systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and superior electrical performance, making it ideal for space-constrained applications.

Propagation Delay (tpd): 0.3 ns

This product features a low propagation delay, ensuring fast and accurate signal transmission, minimizing signal degradation and ensuring reliable data transfer.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, allowing for reliable operation in demanding environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexible signal control, allowing the product to interface with multiple devices while reducing signal conflicts and power consumption.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this product remains functional in extreme cold conditions, ensuring reliability and performance in harsh environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: BOTTOM

The bottom terminal position offers ease of assembly and efficient PCB layout, optimizing space utilization and simplifying manufacturing processes.

No. of Ports: 2

With two ports, this product allows for simultaneous communication with multiple devices, enhancing system connectivity and efficiency.

Maximum Seated Height: 1.4 mm

With a low maximum seated height of 1.4mm, this product offers a compact form factor, enabling integration into slim and space-constrained applications.

Width: 5.5 mm

With a narrow width of 5.5mm, this product can fit into tight spaces, making it suitable for applications with limited board real estate.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components, minimizing errors and improving system reliability.

Minimum Supply Voltage (Vsup): 2.3 V

With a low minimum supply voltage of 2.3V, this product remains operational even with varying power supply conditions, ensuring system reliability and stability.

Peak Reflow Temperature °C: 260

This product can withstand high-temperature reflow processes up to 260°C, enabling efficient and reliable soldering during manufacturing.

Length: 13.5 mm

With a compact length of 13.5mm, this product offers a small footprint, allowing for space-saving integration in various electronic systems or devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation over a wide temperature range, making this product suitable for industrial environments with demanding temperature conditions.

Technology: CMOS

The CMOS technology employed in this product provides low power consumption, high noise immunity, and excellent signal integrity, contributing to energy efficiency and reliable performance.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and easy soldering with automated assembly processes, ensuring secure and stable operation.

Packing Method: TR

The tape and reel packing method simplifies handling, storage, and automated pick-and-place assembly processes, improving manufacturing efficiency and reducing waste.

Terminal Pitch: 0.8 mm

With a narrow terminal pitch of 0.8mm, this product enables high-density PCB designs, allowing for compact and miniaturized electronic devices.

Count Direction: BIDIRECTIONAL

The bidirectional count direction capability of this product ensures versatility and compatibility in applications requiring bidirectional data flow.

Control Type: ENABLE LOW

The enable low control type simplifies system control and integration, allowing for easy activation or deactivation of the product's functionality.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage of the product, minimizing the risk of moisture-related damage during manufacturing and usage.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product provides flexibility in voltage input, accommodating different power supply configurations.

Maximum Power Supply Current (ICC): 4 mA

The maximum power supply current of 4mA ensures low power consumption, contributing to energy efficiency and prolonged battery life.

Technical Specifications

Bus Driver & Transceivers SN74CB3Q32245ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

32

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

4 mA

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74CB3Q32245ZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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