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SN74BCT29828BDW

Texas Instruments

SN74BCT29828BDW by Texas Instruments

BUS DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$3.860

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 950 parts In-Stock

1+ parts

$3.270

100+ parts

$3.200

1k+ parts

$3.140

10k+ parts

-

950

$3.270

$3.200

$3.140

-

DigiKey

USA . 950 parts In-Stock

1+ parts

-

100+ parts

$3.860

1k+ parts

-

10k+ parts

-

950

-

$3.860

-

-

Verical

USA . 950 parts In-Stock

1+ parts

-

100+ parts

$4.362

1k+ parts

$3.938

10k+ parts

-

950

-

$4.362

$3.938

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,856 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

$3.524

-

-

-

Vyrian

USA . 3,317 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,317

$3.710

-

-

-

Bristol Electronics

USA . 611 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

611

-

-

-

-

M&R Communications

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,790 parts In-Stock

1+ parts

$3.339

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

$3.339

-

-

-

Andel Nordic

Denmark . 5,394 parts In-Stock

1+ parts

$3.637

100+ parts

-

1k+ parts

$3.492

10k+ parts

$3.492

5,394

$3.637

-

$3.492

$3.492

Component Stockers USA

USA . 1,206 parts In-Stock

1+ parts

$3.770

100+ parts

$3.540

1k+ parts

-

10k+ parts

-

1,206

$3.770

$3.540

-

-

Parana Technologies

USA . 1,217 parts In-Stock

1+ parts

$14.227

100+ parts

-

1k+ parts

$14.678

10k+ parts

-

1,217

$14.227

-

$14.678

-

DigiPath Technology Company

USA . 381 parts In-Stock

1+ parts

$15.665

100+ parts

$14.412

1k+ parts

-

10k+ parts

-

381

$15.665

$14.412

-

-

ChromeModa Solutions

Germany . 3,514 parts In-Stock

1+ parts

$15.985

100+ parts

$13.108

1k+ parts

-

10k+ parts

-

3,514

$15.985

$13.108

-

-

IDEA Electronic Components Group

UK . 584 parts In-Stock

1+ parts

$15.985

100+ parts

$15.186

1k+ parts

$14.386

10k+ parts

-

584

$15.985

$15.186

$14.386

-

Technical Specifications

Bus Driver & Transceivers SN74BCT29828BDW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74BCT29828BDW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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