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SN74AVCH32T245ZKER

Texas Instruments

SN74AVCH32T245ZKER by Texas Instruments

SN74AVCH32T245ZKER by Texas Instruments is a 96-terminal bus driver with 4 functions, operating at 1.5V/3.3V supply voltage. It features a propagation delay of 6.2ns and supports bidirectional communication in industrial applications, with a max temperature of 85°C.

Median Price

$2.180

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,468 parts In-Stock

1+ parts

$2.180

100+ parts

$2.140

1k+ parts

$2.090

10k+ parts

-

18,468

$2.180

$2.140

$2.090

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 7,490 parts In-Stock

1+ parts

$3.506

100+ parts

$3.681

1k+ parts

$3.471

10k+ parts

-

7,490

$3.506

$3.681

$3.471

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 2,458 parts In-Stock

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2,458

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Euro-Tech

UK . 1,523 parts In-Stock

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1,523

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Digiode

USA . 1,415 parts In-Stock

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1,415

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Contempo Components LLC

USA . 241 parts In-Stock

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241

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Prism Electronics

USA . 60 parts In-Stock

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60

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,693 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

$2.947

10k+ parts

$2.947

4,693

$3.070

-

$2.947

$2.947

AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$11.551

100+ parts

-

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425

$11.551

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Parana Technologies

USA . 661 parts In-Stock

1+ parts

$17.434

100+ parts

-

1k+ parts

$17.636

10k+ parts

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661

$17.434

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$17.636

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Ampacity Inc.

Singapore . 1,012 parts In-Stock

1+ parts

$18.000

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1,012

$18.000

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DigiPath Technology Company

USA . 874 parts In-Stock

1+ parts

$19.197

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874

$19.197

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ChromeModa Solutions

Germany . 6,770 parts In-Stock

1+ parts

$19.589

100+ parts

$16.063

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6,770

$19.589

$16.063

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IDEA Electronic Components Group

UK . 1,538 parts In-Stock

1+ parts

$19.589

100+ parts

$18.610

1k+ parts

$17.630

10k+ parts

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1,538

$19.589

$18.610

$17.630

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One Stop Electronics

USA . 1,458 parts In-Stock

1+ parts

$46.000

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1,458

$46.000

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Perfect Parts

USA . 2,248 parts In-Stock

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2,248

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Kepictronics

USA . 812 parts In-Stock

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812

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Corphita

USA . 519 parts In-Stock

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519

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Microchip USA

USA . 371 parts In-Stock

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371

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Overview

Enhance your electronic designs with the SN74AVCH32T245ZKER by Texas Instruments, a top-quality Bus Driver & Transceiver. With 4 functions and 8 bits, this product offers seamless voltage translation from 1.5V to 3.3V, providing versatility in various applications. Benefit from a low propagation delay of 6.2 ns, 3-STATE output characteristics, and a compact GRID ARRAY package style. Trust in Texas Instruments' reputation for excellence and innovation in the industry. Elevate your projects with the value and reliability that this transceiver brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic and epoxy material ensures a long-lasting and sturdy construction for reliable performance.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast data transmission and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

No. of Functions: 4

Multiple functions in one device provide versatility and efficiency in managing bus communication.

Package Shape: RECTANGULAR

Rectangular shape enables compact and space-saving design for optimized PCB layout.

No. of Bits: 8

8 bits allow for a wide range of data processing and handling capabilities.

Translation: 1.5/3.3V&1.5/3.3V

Supports multiple voltage translations for compatibility with different systems and components.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage ensures consistent performance and efficient power management.

Load Capacitance (CL): 15 pF

Low load capacitance helps in minimizing signal distortion and improving signal integrity.

Power Supplies (V): 1.5/3.3

Versatile power supply options for flexibility in voltage selection.

No. of Terminals: 96

High terminal count allows for multiple connection points and increased functionality.

Technical Specifications

Bus Driver & Transceivers SN74AVCH32T245ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.09 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

5.5 mm

Trade Compliance

SN74AVCH32T245ZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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