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SN74AVC24T245ZRGR

Texas Instruments

SN74AVC24T245ZRGR by Texas Instruments

Texas Instruments SN74AVC24T245ZRGR is a 6-bit bus driver with 6.2ns propagation delay, translating b/w 1.5V and 3.3V signals. Ideal for industrial applications, it features a grid array package style, operates at -40 to 85°C, and has a max seated height of 1mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,280 parts In-Stock

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Vyrian

USA . 755 parts In-Stock

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Bristol Electronics

USA . 590 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Andel Nordic

Denmark . 1,845 parts In-Stock

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$3.339

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$3.205

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$3.205

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$3.205

Ampacity Inc.

Singapore . 561 parts In-Stock

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$4.000

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Corohmni

South Africa . 130 parts In-Stock

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$17.611

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AZTECH Wire

Italy . 258 parts In-Stock

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$19.561

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One Stop Electronics

USA . 1,307 parts In-Stock

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$20.000

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Parana Technologies

USA . 1,823 parts In-Stock

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$25.883

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$26.479

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$25.883

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$26.479

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DigiPath Technology Company

USA . 551 parts In-Stock

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$28.500

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$26.220

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551

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ChromeModa Solutions

Germany . 4,887 parts In-Stock

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$29.082

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$23.847

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IDEA Electronic Components Group

UK . 2,237 parts In-Stock

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$29.082

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$27.628

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$26.174

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Semicontronic

India . 599 parts In-Stock

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$47.000

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$45.825

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$45.590

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599

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Continental Prestige Electronics

USA . 2,823 parts In-Stock

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Kepictronics

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Argo Parts USA

USA . 1,547 parts In-Stock

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Corphita

USA . 918 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Microchip USA

USA . 341 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of the SN74AVC24T245ZRGR bus driver & transceiver by industry leader Texas Instruments. This versatile component offers seamless translation between different voltage levels, making it ideal for a wide range of applications. With a compact design and advanced features, this product provides exceptional value and performance to customers looking for high-quality electronic components. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with precision and efficiency. Elevate your projects with the SN74AVC24T245ZRGR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 6.2 ns

With a low propagation delay, this product offers fast and efficient signal transmission.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

No. of Functions: 6

With multiple functions, this product offers versatility in bus driver and transceiver applications.

Package Shape: RECTANGULAR

The rectangular package shape makes this product easy to handle and integrate into existing designs.

No. of Bits: 4

A 4-bit configuration provides sufficient data processing capability for various communication protocols.

Translation: 1.5/3.3V&1.5/3.3V

This translation feature allows for compatibility with different voltage levels, making it versatile for use.

Nominal Supply Voltage / Vsup (V): 1.5

The nominal supply voltage of 1.5V ensures energy efficiency and reliable operation.

Load Capacitance (CL): 15 pF

With a low load capacitance, this product ensures minimal signal distortion and high-speed performance.

Power Supplies (V): 1.5/3.3

Supporting multiple power supply voltages, this product can be used in various system configurations.

No. of Terminals: 83

The high number of terminals allows for a wide range of connectivity options in complex circuit designs.

Maximum I (ol): 12 Amp

With a high output current capability, this product can drive heavy loads with ease.

Propagation Delay (tpd): 6.2 ns

The short propagation delay ensures minimal signal delay and efficient data transmission.

Maximum Operating Temperature: 85 °C

This product can operate reliably in a wide range of temperatures, suitable for industrial environments.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control of the bus driver, enhancing system functionality.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product can function in extreme cold conditions.

No. of Ports: 2

Two ports provide flexibility in connecting to different devices or systems.

Maximum Seated Height: 1 mm

The low seated height of 1mm saves space on the PCB and facilitates compact designs.

Width: 4.5 mm

The slim width of 4.5mm enables dense packaging and efficient use of PCB space.

Output Polarity: TRUE

The true output polarity simplifies circuit design and ensures compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 1.2V

With a low minimum supply voltage requirement, this product is efficient in power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product is suitable for lead-free soldering processes.

Length: 10 mm

The compact length of 10mm makes this product suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and simplifies soldering processes.

Packing Method: TR

The TR packing method ensures safe transportation and handling of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on the PCB.

Count Direction: BIDIRECTIONAL

Supporting bidirectional communication, this product can transmit and receive data efficiently.

Control Type: COMMON CONTROL

With a common control interface, this product simplifies system integration and operation.

Maximum Supply Voltage (Vsup): 3.6V

The high maximum supply voltage rating of 3.6V ensures compatibility with a wide range of systems.

Maximum Power Supply Current (ICC): 0.075 mA

This product consumes minimal power, making it energy-efficient for long-term usage.

Technical Specifications

Bus Driver & Transceivers SN74AVC24T245ZRGR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B83

JESD-609 Code:

e1

Length:

10 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

6

No. of Ports:

2

No. of Terminals:

83

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA83,6X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.075 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

4.5 mm

Trade Compliance

SN74AVC24T245ZRGR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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