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SN74AUP1T98DSFR

Texas Instruments

SN74AUP1T98DSFR by Texas Instruments

SN74AUP1T98DSFR from Texas Instruments is a compact interface IC with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features a push-pull output and supports power supplies of 2.5/3.3V, ideal for industrial applications. Its small outline design ensures efficient space utilization in circuits.

Median Price

$0.426

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 374,700 parts In-Stock

1+ parts

$0.479

100+ parts

$0.326

1k+ parts

$0.167

10k+ parts

-

374,700

$0.479

$0.326

$0.167

-

Mouser Electronics

USA . 4,800 parts In-Stock

1+ parts

$0.650

100+ parts

-

1k+ parts

$0.538

10k+ parts

$0.344

4,800

$0.650

-

$0.538

$0.344

Rochester

USA . 179,283 parts In-Stock

1+ parts

-

100+ parts

$0.358

1k+ parts

$0.297

10k+ parts

$0.265

179,283

-

$0.358

$0.297

$0.265

DigiKey

USA . 179,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.450

10k+ parts

-

179,283

-

-

$0.450

-

Verical

USA . 179,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.403

10k+ parts

$0.331

179,283

-

-

$0.403

$0.331

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.223

5,000

-

-

-

$0.223

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.198

-

-

-

Digiode

USA . 305 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$0.220

-

-

-

Vyrian

USA . 184,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

184,458

-

-

-

-

DigiKey Marketplace

USA . 179,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.240

10k+ parts

-

179,283

-

-

$0.240

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,379 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

$0.192

2,379

$0.198

-

-

$0.192

Continental Prestige Electronics

USA . 2,201 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

$0.194

2,201

$0.198

-

-

$0.194

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.198

-

-

-

Corphita

USA . 2,809 parts In-Stock

1+ parts

$0.209

100+ parts

-

1k+ parts

-

10k+ parts

-

2,809

$0.209

-

-

-

Ampacity Inc.

Singapore . 184,380 parts In-Stock

1+ parts

$0.413

100+ parts

-

1k+ parts

-

10k+ parts

-

184,380

$0.413

-

-

-

Parana Technologies

USA . 2,166 parts In-Stock

1+ parts

$6.306

100+ parts

-

1k+ parts

$7.056

10k+ parts

-

2,166

$6.306

-

$7.056

-

DigiPath Technology Company

USA . 1,031 parts In-Stock

1+ parts

$6.943

100+ parts

-

1k+ parts

-

10k+ parts

-

1,031

$6.943

-

-

-

ChromeModa Solutions

Germany . 2,402 parts In-Stock

1+ parts

$7.085

100+ parts

$5.810

1k+ parts

-

10k+ parts

-

2,402

$7.085

$5.810

-

-

IDEA Electronic Components Group

UK . 246 parts In-Stock

1+ parts

$7.085

100+ parts

-

1k+ parts

$6.376

10k+ parts

-

246

$7.085

-

$6.376

-

Overview

Elevate your designs with the SN74AUP1T98DSFR from Texas Instruments, a leader in innovative semiconductor solutions. This advanced interface IC combines exceptional reliability with a compact design, ensuring seamless integration in space-constrained applications. With low power consumption and robust performance across varied temperatures, it’s perfect for industrial systems. Trust in Texas Instruments’ quality to drive efficiency and enhance your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

This surface mount capability allows for efficient use of board space and enables automatic placement, reducing assembly costs and time.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this IC can accommodate a wide range of power supply conditions, making it versatile for different applications.

Package Shape: SQUARE

The square package shape optimizes space on printed circuit boards (PCBs), allowing for compact design in electronic devices.

Power Supplies (V): 2.5/3.3

Support for both 2.5 V and 3.3 V supplies increases compatibility with various systems and reduces the need for voltage regulators.

No. of Terminals: 6

The 6 terminals provide enough connectivity options for functionality while maintaining a compact form factor, ideal for space-constrained designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

A small outline and very thin profile enhance the product's suitability for slim and portable devices where space is at a premium.

Minimum Supply Voltage: 2.3 V

The capability to operate at a minimum supply voltage of 2.3 V allows for low-power applications, making it energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C enables the IC to function reliably in various environmental conditions, enhancing its durability.

Output Characteristics: PUSH-PULL

Push-pull output configuration allows for more efficient switching and better drive capabilities, ensuring robust performance in various driving applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is designed for industrial applications, ensuring reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of high-quality terminal finishes enhances solderability and corrosion resistance, leading to better performance and longevity of the device.

Terminal Position: DUAL

Dual terminal positioning facilitates flexibility in PCB design and connection options, enhancing usability in multiple applications.

Maximum Seated Height: 0.4 mm

A maximum seated height of 0.4 mm contributes to the IC's low-profile design, making it ideal for ultra-thin devices.

Width: 1 mm

At just 1 mm in width, the compact design allows for high-density layouts, catering to modern, miniaturized electronics.

Peak Reflow Temperature: 260 °C

The ability to withstand a peak reflow temperature of 260 °C ensures compatibility with standard surface mount soldering processes.

Length: 1 mm

A length of 1 mm enhances the small footprint of the IC, making it suited for applications where space is a critical consideration.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions implies the IC is reliable for demanding applications, providing peace of mind for designers.

Terminal Form: NO LEAD

The no-lead terminal design supports a more compact PCB layout while also aiding in enhanced thermal and electrical performance.

Maximum Supply Current: 0.0009 mA

With a maximum supply current of only 0.0009 mA, the IC is energy-efficient, prolonging battery life in portable applications.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V makes it optimal for low-power applications, further enhancing battery performance and reducing heat generation.

Terminal Pitch: 0.35 mm

A terminal pitch of 0.35 mm allows for denser packing of components on PCBs, facilitating modern electronic designs that require high-density layouts.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it provides crucial interconnection capabilities, enabling communication between different parts of electronic systems.

Technical Specifications

Other Function Interface ICs SN74AUP1T98DSFR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

PUSH-PULL

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.0009 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1 mm

Trade Compliance

SN74AUP1T98DSFR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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