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SN74AUP1T57YEPR

Texas Instruments

SN74AUP1T57YEPR by Texas Instruments

SN74AUP1T57YEPR by Texas Instruments is a CMOS interface IC with 6 terminals and a max supply voltage of 3.6V. It operates in industrial temperatures from -40 to 85°C, making it suitable for various applications requiring precise signal switching in compact electronic devices. With a very thin profile and fine pitch package style, this IC is ideal for space-constrained designs where high performance and reliability are essential.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,084 parts In-Stock

1+ parts

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8,084

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Digiode

USA . 1,434 parts In-Stock

1+ parts

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1,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,486 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,486

$0.500

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AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$5.160

100+ parts

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1k+ parts

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525

$5.160

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Parana Technologies

USA . 798 parts In-Stock

1+ parts

$12.343

100+ parts

-

1k+ parts

$12.779

10k+ parts

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798

$12.343

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$12.779

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DigiPath Technology Company

USA . 645 parts In-Stock

1+ parts

$13.592

100+ parts

$12.504

1k+ parts

-

10k+ parts

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645

$13.592

$12.504

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ChromeModa Solutions

Germany . 5,841 parts In-Stock

1+ parts

$13.869

100+ parts

$11.373

1k+ parts

-

10k+ parts

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5,841

$13.869

$11.373

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IDEA Electronic Components Group

UK . 1,758 parts In-Stock

1+ parts

$13.869

100+ parts

$13.176

1k+ parts

$12.482

10k+ parts

-

1,758

$13.869

$13.176

$12.482

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Corphita

USA . 428 parts In-Stock

1+ parts

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428

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Overview

Unlock the potential of your electronic devices with the SN74AUP1T57YEPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. This interface IC is perfect for a wide range of applications, offering seamless connectivity and superior performance. With a low supply voltage and high operating temperature range, this product provides exceptional value and benefits to customers looking for a compact and versatile solution. Upgrade your projects with the SN74AUP1T57YEPR and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on surface for compact and efficient design.

Maximum Supply Voltage: 3.6 V

Supports high voltage applications.

Package Shape: RECTANGULAR

Common shape for easy integration into various electronic systems.

Power Supplies (V): 1.2/3.3

Supports multiple power supply options for flexibility in usage.

No. of Terminals: 6

Sufficient terminals for required connections.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact design with fine pitch for space-saving and efficient layouts.

Minimum Supply Voltage: 2.3 V

Supports lower supply voltages for energy-efficient operations.

Maximum Operating Temperature: 85 °C

Can operate effectively at high temperatures for industrial applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures for versatility in different environments.

Terminal Position: BOTTOM

Bottom terminal position for convenient connectivity in circuit boards.

Maximum Seated Height: 0.5 mm

Low profile design for slim and compact devices.

Width: 0.9 mm

Narrow width for space-efficient applications.

Length: 1.4 mm

Compact length for fitting into tight spaces.

Temperature Grade: INDUSTRIAL

Suitable for industrial settings with robust temperature tolerance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for secure connections.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections in dense layouts.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications.

Technical Specifications

Other Function Interface ICs SN74AUP1T57YEPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-XBGA-B6

Length:

1.4 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74AUP1T57YEPR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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