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SN74AUP1T58DBVRE4

Texas Instruments

SN74AUP1T58DBVRE4 by Texas Instruments

SN74AUP1T58DBVRE4 by Texas Instruments is a CMOS interface IC with 6 terminals and a supply voltage range of 1.2-3.3 V. It operates in industrial temperatures (-40 to 85 °C) and has a small outline package style for surface mount applications. This IC is suitable for various other function interface circuits requiring low profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,433 parts In-Stock

1+ parts

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9,433

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Digiode

USA . 4,863 parts In-Stock

1+ parts

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4,863

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,522 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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10k+ parts

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1,522

$2.500

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AZTECH Wire

Italy . 341 parts In-Stock

1+ parts

$6.932

100+ parts

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341

$6.932

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Parana Technologies

USA . 551 parts In-Stock

1+ parts

$12.926

100+ parts

-

1k+ parts

$13.414

10k+ parts

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551

$12.926

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$13.414

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DigiPath Technology Company

USA . 2,264 parts In-Stock

1+ parts

$14.234

100+ parts

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2,264

$14.234

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

1+ parts

$14.524

100+ parts

$13.798

1k+ parts

$13.072

10k+ parts

-

1,357

$14.524

$13.798

$13.072

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ChromeModa Solutions

Germany . 483 parts In-Stock

1+ parts

$14.524

100+ parts

$11.910

1k+ parts

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10k+ parts

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483

$14.524

$11.910

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Corphita

USA . 687 parts In-Stock

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687

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Overview

Unleash the power of innovation with the SN74AUP1T58DBVRE4 from Texas Instruments. This cutting-edge Interface IC boasts unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With its sleek design and advanced technology, this product delivers unmatched performance, efficiency, and versatility. Say goodbye to limitations and experience the next level of functionality with the SN74AUP1T58DBVRE4. Upgrade your projects today and witness the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for versatility in power sources, making the product suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and fits well in compact electronic devices.

Power Supplies (V): 1.2/3.3

Supports dual power supply options, providing flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 6

Sufficient number of terminals for connectivity and functionality in the circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and allows for a sleek design in electronic devices.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage enables efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good conductivity and resistance to corrosion, enhancing the product's longevity.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation orientation and allows for easy integration into different circuit layouts.

Maximum Seated Height: 1.45 mm

Low seated height is space-efficient and allows for compact design in electronic devices.

Width: 1.6 mm

Narrow width saves space on the circuit board and enables design in compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time ensures proper soldering and connection during manufacturing, ensuring reliability in operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for secure solder joints and reliable connections during assembly.

Length: 2.9 mm

Compact length fits well in small electronic devices and saves space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures durability and reliability in harsh operating conditions.

Technology: CMOS

CMOS technology provides low power consumption and fast switching speed, making the product energy-efficient and high-performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and installation on the circuit board, ensuring secure connections.

Nominal Supply Voltage: 2.5 V

Optimal supply voltage for efficient operation and compatibility with standard voltage levels in electronic devices.

Terminal Pitch: 0.95 mm

Fine terminal pitch allows for precise connection and integration into tight spacing on the circuit board.

Interface IC Type: INTERFACE CIRCUIT

Specific interface IC type tailored for efficient communication and connectivity in electronic systems.

Technical Specifications

Other Function Interface ICs SN74AUP1T58DBVRE4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74AUP1T58DBVRE4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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