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SN74AUP1T57DCKRE4

Texas Instruments

SN74AUP1T57DCKRE4 by Texas Instruments

SN74AUP1T57DCKRE4 by Texas Instruments is a CMOS interface IC with 6 terminals and a supply voltage range of 1.2V to 3.3V. It operates in industrial temperatures from -40°C to 85°C, making it suitable for various applications requiring thin profile small outline packages and dual terminal positions. With a max seated height of 1.1mm, this IC is ideal for compact electronic devices needing reliable signal transmission at peak reflow temperature of 260°C within 30 seconds.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,216 parts In-Stock

1+ parts

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5,216

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Digiode

USA . 2,021 parts In-Stock

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2,021

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$8.655

100+ parts

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494

$8.655

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Parana Technologies

USA . 1,357 parts In-Stock

1+ parts

$8.967

100+ parts

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$9.637

10k+ parts

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1,357

$8.967

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$9.637

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ChromeModa Solutions

Germany . 6,648 parts In-Stock

1+ parts

$10.075

100+ parts

$8.262

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6,648

$10.075

$8.262

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IDEA Electronic Components Group

UK . 28 parts In-Stock

1+ parts

$10.075

100+ parts

$9.571

1k+ parts

$9.068

10k+ parts

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28

$10.075

$9.571

$9.068

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One Stop Electronics

USA . 702 parts In-Stock

1+ parts

$15.500

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702

$15.500

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Ampacity Inc.

Singapore . 1,062 parts In-Stock

1+ parts

$36.500

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1,062

$36.500

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Corphita

USA . 3,826 parts In-Stock

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3,826

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Aranea Global

USA . 500 parts In-Stock

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500

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DigiPath Technology Company

USA . 414 parts In-Stock

1+ parts

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$9.084

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414

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$9.084

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Overview

Unlock the potential of your electronic projects with the SN74AUP1T57DCKRE4 by Texas Instruments. Known for its high-quality manufacturing, Texas Instruments delivers top-notch products that exceed industry standards. This versatile Other Function Interface IC is perfect for a wide range of applications, offering seamless integration and reliable performance. Experience the value and benefits of this innovative product, designed to provide customers with the advantages they need to succeed in today's competitive market. Elevate your projects with Texas Instruments' SN74AUP1T57DCKRE4 and discover the possibilities it can bring to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the package lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a variety of power sources and enables flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape is standardized and easy to work with, making it compatible with commonly used design layouts.

Power Supplies (V): 1.2/3.3

The dual power supply options allow for versatile operation and make the IC adaptable to different voltage requirements.

No. of Terminals: 6

Having a sufficient number of terminals provides connectivity for various functions and signals, enhancing the IC's utility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space and enables compact designs, ideal for applications with limited board space.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage allows the IC to operate efficiently even with lower power sources, increasing its versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand elevated environmental conditions, ensuring reliable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the IC to function in extreme cold conditions, making it suitable for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring long-term reliability of the IC.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and installation, allowing for different orientation options based on design requirements.

Maximum Seated Height: 1.1 mm

The low maximum seated height minimizes the overall profile of the IC, contributing to space-saving designs and compact electronic devices.

Width: 1.25 mm

The narrow width of the IC facilitates densely packed circuit layouts and enables miniaturization of electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature enhances manufacturing efficiency by allowing for quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures proper soldering of the IC onto boards, contributing to robust and reliable connections.

Length: 2 mm

The compact length of the IC enables space-efficient placement on circuit boards, contributing to overall size reduction of electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates the IC's ability to operate reliably in harsh industrial environments, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in the IC offers low power consumption, high noise immunity, and compatibility with a wide range of applications, enhancing its versatility.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto PCBs and provides mechanical stability, ensuring secure connections in electronic assemblies.

Nominal Supply Voltage: 2.5 V

The 2.5 V nominal supply voltage offers a standard operating level for the IC, ensuring compatibility with common power sources and ease of integration.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting of the IC on circuit boards, maximizing board space utilization and enabling compact designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and interaction between different components or systems, making it essential for seamless device operation.

Technical Specifications

Other Function Interface ICs SN74AUP1T57DCKRE4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUP1T57DCKRE4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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