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SN74AUP1T58DCKRE4

Texas Instruments

SN74AUP1T58DCKRE4 by Texas Instruments

SN74AUP1T58DCKRE4 by Texas Instruments is a CMOS interface IC with 6 terminals and a supply voltage range of 2.3V to 3.6V. It operates in industrial temperatures from -40°C to 85°C, making it suitable for various applications requiring a small outline package with surface mount capabilities. The terminal finish is nickel palladium gold, and the package style is thin profile with shrink pitch, ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,458 parts In-Stock

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9,458

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Digiode

USA . 3,894 parts In-Stock

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3,894

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$10.454

100+ parts

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444

$10.454

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Parana Technologies

USA . 43 parts In-Stock

1+ parts

$11.383

100+ parts

-

1k+ parts

$11.806

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43

$11.383

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$11.806

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One Stop Electronics

USA . 883 parts In-Stock

1+ parts

$12.500

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883

$12.500

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DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

$12.534

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698

$12.534

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ChromeModa Solutions

Germany . 5,430 parts In-Stock

1+ parts

$12.790

100+ parts

$10.488

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5,430

$12.790

$10.488

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IDEA Electronic Components Group

UK . 539 parts In-Stock

1+ parts

$12.790

100+ parts

$12.150

1k+ parts

$11.511

10k+ parts

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539

$12.790

$12.150

$11.511

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Corphita

USA . 1,268 parts In-Stock

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Overview

Unlock a world of possibilities with the SN74AUP1T58DCKRE4 by Texas Instruments. Crafted with precision and expertise, this interface IC offers unparalleled quality and reliability. From industrial applications to consumer electronics, this versatile component delivers exceptional performance at every turn. Experience the seamless integration and superior functionality that only Texas Instruments can provide. Elevate your projects and streamline your designs with the SN74AUP1T58DCKRE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources, making the product versatile and reliable.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

Power Supplies (V): 1.2/3.3

Supporting multiple power supply options provides flexibility for different application requirements, making the product adaptable to various scenarios.

No. of Terminals: 6

Having a sufficient number of terminals allows for proper connectivity and functionality within the circuit, ensuring reliable performance.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enable space-saving and efficient integration into compact electronic devices.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement ensures efficient power consumption and operation, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated heat levels, ensuring stable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable operation even in extreme cold conditions, enhancing the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and durability.

Terminal Position: DUAL

Having dual terminal positions allows for increased flexibility in circuit board layout and connection options, enhancing the product's versatility.

Maximum Seated Height: 1.1 mm

The low maximum seated height enables a slim and compact design, making the product suitable for space-constrained applications.

Width: 1.25 mm

The narrow width of the product facilitates efficient placement on the circuit board, saving valuable space and allowing for optimal component arrangement.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures proper soldering and bonding during the assembly process, contributing to the product's reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, the product can withstand the soldering process without damage, ensuring a secure and durable connection.

Length: 2 mm

The compact length of the product allows for space-efficient integration into electronic devices, contributing to a streamlined and compact design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable connection on the circuit board, ensuring secure and stable operation.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage specification provides a standard operating voltage for the product, ensuring compatibility with common power sources.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting and efficient use of space on the circuit board, enhancing design flexibility and compactness.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit functionality enables seamless communication and data exchange between different components or systems, making the product essential for interface applications.

Technical Specifications

Other Function Interface ICs SN74AUP1T58DCKRE4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUP1T58DCKRE4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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