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SN74AUP1G98DBVRG4

Texas Instruments

SN74AUP1G98DBVRG4 by Texas Instruments

SN74AUP1G98DBVRG4 by Texas Instruments is a CMOS logic IC with 26.8ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It operates at a supply voltage of 1.2V/3.3V and is ideal for industrial applications requiring Schmitt Trigger functionality in a compact package with dual terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,906 parts In-Stock

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Digiode

USA . 817 parts In-Stock

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817

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Distributors (Availability)

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Parana Technologies

USA . 1,723 parts In-Stock

1+ parts

$17.694

100+ parts

-

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$17.878

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1,723

$17.694

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$17.878

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AZTECH Wire

Italy . 776 parts In-Stock

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$19.106

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776

$19.106

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DigiPath Technology Company

USA . 749 parts In-Stock

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$19.483

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$17.925

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749

$19.483

$17.925

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ChromeModa Solutions

Germany . 3,112 parts In-Stock

1+ parts

$19.881

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$16.302

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3,112

$19.881

$16.302

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IDEA Electronic Components Group

UK . 1,030 parts In-Stock

1+ parts

$19.881

100+ parts

$18.887

1k+ parts

$17.893

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1,030

$19.881

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$17.893

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One Stop Electronics

USA . 870 parts In-Stock

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$51.000

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870

$51.000

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Corphita

USA . 1,915 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the SN74AUP1G98DBVRG4 by Texas Instruments. Renowned for their high-quality components, Texas Instruments delivers reliable solutions for a wide range of applications in the Other Function Logic ICs category. With a compact package and low power consumption, this IC offers unmatched performance at a nominal supply voltage of 1.2V. Trust in Texas Instruments to provide cutting-edge technology that enhances efficiency and functionality, setting your projects apart from the rest. Upgrade your designs today with the SN74AUP1G98DBVRG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 26.8 ns

Fast propagation delay ensures quick response time in logic operations.

Surface Mount: YES

Easily mountable on circuit boards for convenient installation.

Nominal Supply Voltage / Vsup (V): 1.2

Operates efficiently at a low supply voltage of 1.2V.

Load Capacitance (CL): 30 pF

Capable of driving a load capacitance of 30pF for reliable performance.

Power Supplies (V): 1.2/3.3

Can be powered by two different voltage supplies, offering flexibility in application.

No. of Terminals: 6

Provides multiple connection points for versatile circuit integration.

Maximum I (ol): 1.7 Amp

High output current capability of 1.7A for driving various loads.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C for reliable performance in different environments.

Output Characteristics: 3-STATE

3-state output allows for high impedance output state, enhancing flexibility in circuit design.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for long-lasting connections and improved corrosion resistance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Other Function Logic ICs SN74AUP1G98DBVRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74AUP1G98DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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