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SN74AUP1G32YEPR

Texas Instruments

SN74AUP1G32YEPR by Texas Instruments

SN74AUP1G32YEPR by Texas Instruments is a CMOS logic gate with 2 inputs, 26.7 ns propagation delay, and 1.7 Amp max I (ol). It operates at a supply voltage range of 0.8V to 3.6V and is ideal for industrial applications requiring fast signal processing in compact designs due to its very thin profile and fine pitch package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,427 parts In-Stock

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2,427

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Vyrian

USA . 2,340 parts In-Stock

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2,340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$9.973

100+ parts

-

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388

$9.973

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Parana Technologies

USA . 789 parts In-Stock

1+ parts

$19.347

100+ parts

-

1k+ parts

$19.367

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789

$19.347

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$19.367

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DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$21.303

100+ parts

$19.599

1k+ parts

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1,888

$21.303

$19.599

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ChromeModa Solutions

Germany . 1,642 parts In-Stock

1+ parts

$21.738

100+ parts

$17.825

1k+ parts

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1,642

$21.738

$17.825

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

1+ parts

$21.738

100+ parts

$20.651

1k+ parts

$19.564

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1,214

$21.738

$20.651

$19.564

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One Stop Electronics

USA . 1,177 parts In-Stock

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$35.000

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1,177

$35.000

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Corphita

USA . 700 parts In-Stock

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700

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Microchip USA

USA . 140 parts In-Stock

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140

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Overview

Upgrade your electronic designs with the SN74AUP1G32YEPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality logic gates that offer superior performance and reliability. Ideal for a wide range of applications, this product provides fast propagation delay, low power consumption, and 3-state output characteristics. With a compact package design and high input/output capabilities, the SN74AUP1G32YEPR is the perfect choice for your next project. Experience the value and benefits that Texas Instruments brings to your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is durable and lightweight, making it ideal for electronic components that may need to be transported or handled frequently.

Propagation Delay At Nominal Supply: 26.7 ns

Low propagation delay ensures fast response time, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and reducing assembly time.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations and allows for more complex circuit designs.

Nominal Supply Voltage: 1.2 V

Operates efficiently at a low supply voltage, making it energy-efficient and suitable for battery-powered devices.

Load Capacitance: 30 pF

Suitable for driving moderate loads, ensuring signal integrity and stability.

Power Supplies: 1.2/3.3 V

Compatible with multiple power supply voltages, providing flexibility in different circuit configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making it a versatile choice for logic gates.

Technical Specifications

Logic Gates SN74AUP1G32YEPR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PBGA-B5

Length:

1.4 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA5,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.7 ns

Propagation Delay (tpd):

26.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74AUP1G32YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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