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SN74AUC125RGYRG4

Texas Instruments

SN74AUC125RGYRG4 by Texas Instruments

SN74AUC125RGYRG4 by Texas Instruments is a 4-function bus driver with 3.7ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 1.2V and has a max operating temperature of 85°C. This chip carrier package features a very thin profile and is surface mountable, making it ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,832 parts In-Stock

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Digiode

USA . 482 parts In-Stock

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Bristol Electronics

USA . 302 parts In-Stock

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SPM Sales

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Andel Nordic

Denmark . 1,845 parts In-Stock

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$3.210

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$3.081

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$3.081

1,845

$3.210

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$3.081

$3.081

AZTECH Wire

Italy . 844 parts In-Stock

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$18.447

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844

$18.447

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Parana Technologies

USA . 529 parts In-Stock

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$21.114

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$21.375

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DigiPath Technology Company

USA . 1,398 parts In-Stock

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$23.250

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$21.390

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$23.250

$21.390

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ChromeModa Solutions

Germany . 5,599 parts In-Stock

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$23.724

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$19.454

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IDEA Electronic Components Group

UK . 2,110 parts In-Stock

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$23.724

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$22.538

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$21.352

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One Stop Electronics

USA . 1,115 parts In-Stock

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$32.000

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Component Stockers USA

USA . 468 parts In-Stock

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$99.990

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Corphita

USA . 3,664 parts In-Stock

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Microchip USA

USA . 1,398 parts In-Stock

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Kepictronics

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Overview

Discover the cutting-edge SN74AUC125RGYRG4 by Texas Instruments, a top-of-the-line Bus Driver & Transceiver. Manufactured with precision and expertise, this product offers unmatched reliability and performance. Ideal for a variety of applications, this chip carrier boasts a true output polarity, enabling seamless communication in industrial settings. With a low minimum supply voltage and quick propagation delay, customers can trust in the quality and value that this innovative technology provides. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, allowing for easy handling and transportation.

Propagation Delay At Nominal Supply: 3.7 ns

With a low propagation delay, this product enables fast and efficient communication within the bus system.

Surface Mount: YES

Being surface mountable, this product simplifies the assembly process and saves space on the PCB.

No. of Functions: 4

Having multiple functions in a single component enhances the versatility and functionality of the bus driver.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V reduces power consumption and heat dissipation, making it energy-efficient.

Load Capacitance (CL): 15 pF

The load capacitance of 15 pF ensures stable and reliable performance in driving bus signals.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, enabling bus sharing and reducing signal interference.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Bus Driver & Transceivers SN74AUC125RGYRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AUC

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

3.5 mm

Trade Compliance

SN74AUC125RGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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