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SN74AS86ADG4

Texas Instruments

SN74AS86ADG4 by Texas Instruments

SN74AS86ADG4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 7ns at 5V, suitable for commercial temperature grades. This small outline package features surface mount capability and a max supply voltage of 5.5V, making it ideal for various digital applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,635 parts In-Stock

1+ parts

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5,635

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Digiode

USA . 1,290 parts In-Stock

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1,290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 240 parts In-Stock

1+ parts

$7.778

100+ parts

-

1k+ parts

$8.322

10k+ parts

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240

$7.778

-

$8.322

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DigiPath Technology Company

USA . 116 parts In-Stock

1+ parts

$8.564

100+ parts

$7.879

1k+ parts

-

10k+ parts

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116

$8.564

$7.879

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ChromeModa Solutions

Germany . 4,540 parts In-Stock

1+ parts

$8.739

100+ parts

$7.166

1k+ parts

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4,540

$8.739

$7.166

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IDEA Electronic Components Group

UK . 1,661 parts In-Stock

1+ parts

$8.739

100+ parts

$8.302

1k+ parts

$7.865

10k+ parts

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1,661

$8.739

$8.302

$7.865

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$9.285

100+ parts

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641

$9.285

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One Stop Electronics

USA . 644 parts In-Stock

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$23.000

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644

$23.000

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Microchip USA

USA . 2,872 parts In-Stock

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2,872

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Corphita

USA . 2,144 parts In-Stock

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Overview

Unleash the power of efficient logic gates with the SN74AS86ADG4 by Texas Instruments. Crafted with precision and reliability, this product exemplifies the superior quality that TI is renowned for. Perfect for a wide range of applications in electronics, this logic gate offers fast propagation delay and low power consumption, ensuring optimal performance. Experience seamless operation and enhanced functionality with this cutting-edge technology, designed to elevate your projects to new heights. Trust Texas Instruments for innovation that delivers value and excellence in every aspect.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring product longevity.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast and efficient operation, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 4

Having multiple functions in a single component reduces the overall component count in a circuit, leading to cost and space savings.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations, allowing for a variety of logic functions to be implemented.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and easy to integrate into existing circuits.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable and reliable performance in various environments, making this product versatile.

Power Supplies (V): 5

Matching power supply voltage ensures optimal performance and prevents damage to the component, ensuring long-term reliability.

No. of Terminals: 14

Having 14 terminals provides enough connectivity options for various configurations, making this component versatile in different circuit designs.

Maximum I (ol): 20 Amp

High output current capability allows this product to drive heavy loads, making it suitable for applications that require robust driving capabilities.

Maximum Operating Temperature: 70 °C

Wide operating temperature range enables this product to function reliably in different environmental conditions, enhancing its usability.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures consistent performance even in cold environments, making this product suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Width: 3.9 mm

Compact width saves space on the PCB, allowing for efficient use of board real estate in densely populated circuits.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables operation in systems with limited power resources, enhancing compatibility.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, making this product suitable for commercial electronics applications.

Technology: TTL

TTL technology offers high-speed operation and compatibility with TTL logic levels, making this product suitable for fast digital circuits.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into PCB layouts and facilitates soldering during assembly, simplifying manufacturing processes.

Maximum Supply Voltage (Vsup): 5.5 V

Having a maximum supply voltage of 5.5V provides a safety margin for voltage spikes, ensuring protection against overvoltage conditions.

Maximum Power Supply Current (ICC): 38 mA

Low power supply current consumption reduces energy consumption and heat generation, contributing to overall system efficiency and reliability.

Technical Specifications

Logic Gates SN74AS86ADG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AS86ADG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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