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SN74AS756DWE4

Texas Instruments

SN74AS756DWE4 by Texas Instruments

SN74AS756DWE4 by Texas Instruments is a TTL technology bus driver with 2 functions, 4 bits, and inverted output polarity. It has a propagation delay of 6 ns at 5V supply voltage, making it ideal for applications requiring fast signal transmission in commercial temperature environments. The package is small outline with gull wing terminals for surface mount assembly.

Median Price

$7.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 153 parts In-Stock

1+ parts

-

100+ parts

$5.800

1k+ parts

$5.190

10k+ parts

$4.880

153

-

$5.800

$5.190

$4.880

DigiKey

USA . 153 parts In-Stock

1+ parts

-

100+ parts

$7.630

1k+ parts

-

10k+ parts

-

153

-

$7.630

-

-

Verical

USA . 153 parts In-Stock

1+ parts

-

100+ parts

$7.250

1k+ parts

$6.487

10k+ parts

$6.100

153

-

$7.250

$6.487

$6.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,411 parts In-Stock

1+ parts

$5.757

100+ parts

-

1k+ parts

-

10k+ parts

-

2,411

$5.757

-

-

-

Vyrian

USA . 6,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,323

-

-

-

-

DigiKey Marketplace

USA . 153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

153

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,511 parts In-Stock

1+ parts

$5.454

100+ parts

-

1k+ parts

-

10k+ parts

-

2,511

$5.454

-

-

-

Andel Nordic

Denmark . 1,841 parts In-Stock

1+ parts

$7.307

100+ parts

-

1k+ parts

$7.015

10k+ parts

$7.015

1,841

$7.307

-

$7.015

$7.015

Parana Technologies

USA . 513 parts In-Stock

1+ parts

$17.220

100+ parts

-

1k+ parts

$17.435

10k+ parts

-

513

$17.220

-

$17.435

-

DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

$18.961

100+ parts

$17.444

1k+ parts

-

10k+ parts

-

2,097

$18.961

$17.444

-

-

ChromeModa Solutions

Germany . 4,887 parts In-Stock

1+ parts

$19.348

100+ parts

$15.865

1k+ parts

-

10k+ parts

-

4,887

$19.348

$15.865

-

-

IDEA Electronic Components Group

UK . 820 parts In-Stock

1+ parts

$19.348

100+ parts

$18.381

1k+ parts

$17.413

10k+ parts

-

820

$19.348

$18.381

$17.413

-

Overview

Enhance your electronic projects with the SN74AS756DWE4 by Texas Instruments. Designed to meet the highest quality standards, this bus driver & transceiver offers reliable performance and versatile applications. With a compact package body material of plastic/epoxy and a nominal supply voltage of 5V, this product ensures seamless integration into your designs. Experience fast propagation delay, open-collector output characteristics, and inverted output polarity for efficient signal transmission. Trust Texas Instruments for innovative solutions that deliver value and benefits to customers seeking top-notch performance in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the driver/transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 19 ns

Fast propagation delay allows for quick signal transmission, making this product suitable for high-speed bus applications.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying the design and reducing overall cost.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with many existing systems and easy to integrate.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other components, providing flexibility in circuit design.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels, making it easy to interface with other TTL-based devices.

Technical Specifications

Bus Driver & Transceivers SN74AS756DWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

AS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay At Nominal Supply:

19 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74AS756DWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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