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SN74AS640DWG4

Texas Instruments

SN74AS640DWG4 by Texas Instruments

SN74AS640DWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6 ns at 5V. It features a 3-STATE output and operates in a temperature range of 0 to 70°C. Commonly used for bidirectional control applications due to its inverted output polarity and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,243 parts In-Stock

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Digiode

USA . 868 parts In-Stock

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868

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Distributors (Availability)

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AZTECH Wire

Italy . 468 parts In-Stock

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$5.954

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468

$5.954

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Andel Nordic

Denmark . 5,654 parts In-Stock

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$8.337

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$8.004

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$8.004

5,654

$8.337

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$8.004

$8.004

One Stop Electronics

USA . 469 parts In-Stock

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$11.000

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469

$11.000

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Parana Technologies

USA . 822 parts In-Stock

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$25.430

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$2,361.558

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$22.887

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822

$25.430

$2,361.558

$22.887

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DigiPath Technology Company

USA . 816 parts In-Stock

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$28.002

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816

$28.002

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ChromeModa Solutions

Germany . 1,646 parts In-Stock

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$28.573

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$23.430

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1,646

$28.573

$23.430

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IDEA Electronic Components Group

UK . 669 parts In-Stock

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$28.573

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$27.144

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$25.716

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669

$28.573

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$25.716

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QUARKTWIN TECHNOLOGY LTD

USA . 29,110 parts In-Stock

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Microchip USA

USA . 4,412 parts In-Stock

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Corphita

USA . 3,279 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the SN74AS640DWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers & transceivers that provide reliable and efficient performance. Ideal for a wide range of applications, this 8-bit device offers customers unmatched value with its fast propagation delay, three-state output characteristics, and inverted polarity. Elevate your projects with the SN74AS640DWG4 and experience unparalleled reliability and precision in data communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 7 ns

The low propagation delay ensures fast signal transmission, making this product suitable for applications requiring quick response times.

Surface Mount: YES

The surface mount feature makes it easy to integrate this product onto a PCB, saving space and making installation easier.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, providing flexibility in controlling the output signal in various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product operates reliably within a typical commercial temperature range, suitable for standard applications.

Technology: TTL

The TTL technology ensures compatibility with TTL logic levels, making it easy to interface with other TTL-based components in a system.

Technical Specifications

Bus Driver & Transceivers SN74AS640DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

123 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74AS640DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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