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SN74AS1032ADRG4

Texas Instruments

SN74AS1032ADRG4 by Texas Instruments

SN74AS1032ADRG4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 6.3 ns at 5V, making it suitable for high-speed applications. With a small outline package style, it is ideal for surface mount designs in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,329 parts In-Stock

1+ parts

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4,329

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Digiode

USA . 2,469 parts In-Stock

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2,469

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 674 parts In-Stock

1+ parts

$10.908

100+ parts

-

1k+ parts

$11.377

10k+ parts

-

674

$10.908

-

$11.377

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DigiPath Technology Company

USA . 548 parts In-Stock

1+ parts

$12.011

100+ parts

$11.050

1k+ parts

-

10k+ parts

-

548

$12.011

$11.050

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ChromeModa Solutions

Germany . 1,416 parts In-Stock

1+ parts

$12.256

100+ parts

$10.050

1k+ parts

-

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1,416

$12.256

$10.050

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IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$12.256

100+ parts

$11.643

1k+ parts

$11.030

10k+ parts

-

664

$12.256

$11.643

$11.030

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AZTECH Wire

Italy . 242 parts In-Stock

1+ parts

$15.727

100+ parts

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242

$15.727

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One Stop Electronics

USA . 174 parts In-Stock

1+ parts

$48.000

100+ parts

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174

$48.000

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Corphita

USA . 1,427 parts In-Stock

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1,427

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Microchip USA

USA . 340 parts In-Stock

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340

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Overview

Unlock the power of cutting-edge technology with the SN74AS1032ADRG4 logic gates from Texas Instruments. Designed with precision and reliability in mind, this product offers customers unparalleled performance and efficiency for a wide range of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this logic gate delivers superior functionality and seamless integration. Trust in Texas Instruments to provide you with the quality and innovation you need to stay ahead in today's competitive market. Elevate your projects with the SN74AS1032ADRG4 and experience the difference that top-tier engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can protect the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6.3 ns

The fast propagation delay ensures quick signal processing, making these logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount compatibility allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions in a single component can reduce the overall complexity of a circuit design and save on board space.

No. of Inputs: 2

With 2 inputs, these logic gates can perform basic logic operations efficiently, making them versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, these logic gates can easily interface with other standard components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, these logic gates can reliably function in a wide range of environments.

Technology: TTL

TTL technology offers high speed and low power consumption, making these logic gates efficient for various digital applications.

Technical Specifications

Logic Gates SN74AS1032ADRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IOH = 48MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V

Family:

AS

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AS1032ADRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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