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SN74ALVTHR16245VR

Texas Instruments

SN74ALVTHR16245VR by Texas Instruments

SN74ALVTHR16245VR by Texas Instruments is a Bus Driver & Transceiver with 8-bit capacity, 4.3 ns propagation delay, and 3-STATE output characteristics. It operates at a nominal voltage of 2.5V and has a max operating temperature of 85°C. Ideal for industrial applications requiring bidirectional control in compact designs.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,318 parts In-Stock

1+ parts

$2.200

100+ parts

$1.591

1k+ parts

$1.083

10k+ parts

-

4,318

$2.200

$1.591

$1.083

-

Mouser Electronics

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.100

880

-

-

-

$1.100

Rochester

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

17

-

$1.490

$1.240

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,229 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

10k+ parts

-

3,229

$1.100

-

-

-

Digiode

USA . 3,984 parts In-Stock

1+ parts

$1.159

100+ parts

-

1k+ parts

-

10k+ parts

-

3,984

$1.159

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,014 parts In-Stock

1+ parts

$1.098

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

$1.098

-

-

-

Parana Technologies

USA . 2,026 parts In-Stock

1+ parts

$8.430

100+ parts

-

1k+ parts

$9.069

10k+ parts

-

2,026

$8.430

-

$9.069

-

DigiPath Technology Company

USA . 2,102 parts In-Stock

1+ parts

$9.283

100+ parts

$8.540

1k+ parts

-

10k+ parts

-

2,102

$9.283

$8.540

-

-

IDEA Electronic Components Group

UK . 1,122 parts In-Stock

1+ parts

$9.472

100+ parts

$8.998

1k+ parts

$8.525

10k+ parts

-

1,122

$9.472

$8.998

$8.525

-

ChromeModa Solutions

Germany . 52 parts In-Stock

1+ parts

$9.472

100+ parts

$7.767

1k+ parts

-

10k+ parts

-

52

$9.472

$7.767

-

-

Microchip USA

USA . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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105

-

-

-

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Overview

Unlock seamless data transmission with the Texas Instruments SN74ALVTHR16245VR Bus Driver & Transceivers. Crafted with precision and reliability in mind, this cutting-edge product boasts a multitude of applications in various industries. Benefit from its fast propagation delay, low power consumption, and versatile package style. Elevate your projects with Texas Instruments' top-notch technology that ensures high performance and efficiency. Experience unparalleled value and innovation with this must-have solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply : 4.3 ns

Low propagation delay ensures fast and efficient data transmission.

Surface Mount : YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Functions : 2

Having multiple functions in a single component can simplify circuit design and reduce overall system complexity.

Nominal Supply Voltage / Vsup (V) : 2.5

Operates at a commonly used voltage level, making it compatible with a wide range of systems.

Load Capacitance (CL) : 30 pF

Having a specified load capacitance helps ensure optimal performance and signal integrity.

Output Characteristics : 3-STATE

3-state output allows for tri-state control, adding flexibility to the device's connectivity options.

Technology : BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74ALVTHR16245VR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

4.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74ALVTHR16245VR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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