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SN74ALVCH162601DGG

Texas Instruments

SN74ALVCH162601DGG by Texas Instruments

SN74ALVCH162601DGG by Texas Instruments is an 18-bit bus driver with a propagation delay of 6.3 ns, operating b/w -40 to 85 °C. It features a small outline package and is ideal for industrial applications requiring true output polarity and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,530 parts In-Stock

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Digiode

USA . 3,824 parts In-Stock

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3,824

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Vyrian

USA . 3,224 parts In-Stock

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Bristol Electronics

USA . 3,150 parts In-Stock

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Andel Nordic

Denmark . 2,557 parts In-Stock

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$2.900

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$2.784

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$2.784

2,557

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$2.784

$2.784

AZTECH Wire

Italy . 1,030 parts In-Stock

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$21.140

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$21.140

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Parana Technologies

USA . 2,078 parts In-Stock

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$29.042

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$54.705

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2,078

$29.042

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$54.705

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DigiPath Technology Company

USA . 1,345 parts In-Stock

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$31.979

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$29.421

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$31.979

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ChromeModa Solutions

Germany . 4,202 parts In-Stock

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$32.632

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$26.758

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$32.632

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IDEA Electronic Components Group

UK . 375 parts In-Stock

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$32.632

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$31.000

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$29.369

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375

$32.632

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$29.369

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Corphita

USA . 3,419 parts In-Stock

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Microchip USA

USA . 1,322 parts In-Stock

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Kepictronics

USA . 188 parts In-Stock

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Overview

Enhance your electronic designs with the SN74ALVCH162601DGG from Texas Instruments, a leading manufacturer known for top-notch quality and reliability. As a Bus Driver & Transceiver, this component offers seamless communication between different parts of your circuitry, ensuring optimal performance. With a wide range of applications in industrial settings, this product delivers exceptional value by providing fast propagation delays and low power consumption. Trust Texas Instruments to elevate your projects with cutting-edge technology and superior components like the SN74ALVCH162601DGG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto PCBs, saving time and effort during production.

Nominal Supply Voltage (Vsup): 1.8V

The low nominal supply voltage of 1.8V ensures efficient power consumption in the product, making it suitable for portable and battery-operated devices.

Propagation Delay (tpd): 6.3 ns

The low propagation delay of 6.3ns ensures fast data transmission, making the product ideal for high-speed communication applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to perform reliably in a wide range of environmental conditions.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers SN74ALVCH162601DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN74ALVCH162601DGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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