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SN74ALS639ADWRG4

Texas Instruments

SN74ALS639ADWRG4 by Texas Instruments

SN74ALS639ADWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 30ns at 5V. It features open-collector/3-state output characteristics and operates b/w 0-70°C. Ideal for bidirectional control applications, this TTL technology device has a small outline package with dual terminals and Gull Wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,996 parts In-Stock

1+ parts

-

100+ parts

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3,996

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Digiode

USA . 3,845 parts In-Stock

1+ parts

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3,845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 119 parts In-Stock

1+ parts

$5.432

100+ parts

-

1k+ parts

$5.214

10k+ parts

$5.214

119

$5.432

-

$5.214

$5.214

Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

$7.502

100+ parts

-

1k+ parts

$8.004

10k+ parts

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1,056

$7.502

-

$8.004

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AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$8.083

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547

$8.083

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DigiPath Technology Company

USA . 201 parts In-Stock

1+ parts

$8.260

100+ parts

$7.600

1k+ parts

-

10k+ parts

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201

$8.260

$7.600

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IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$8.429

100+ parts

$8.008

1k+ parts

$7.586

10k+ parts

-

1,500

$8.429

$8.008

$7.586

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ChromeModa Solutions

Germany . 281 parts In-Stock

1+ parts

$8.429

100+ parts

$6.912

1k+ parts

-

10k+ parts

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281

$8.429

$6.912

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One Stop Electronics

USA . 325 parts In-Stock

1+ parts

$41.000

100+ parts

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325

$41.000

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Corphita

USA . 2,607 parts In-Stock

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2,607

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Microchip USA

USA . 217 parts In-Stock

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217

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Overview

Enhance your electronic designs with the SN74ALS639ADWRG4 by Texas Instruments. With a track record of excellence in manufacturing, Texas Instruments delivers top-quality bus drivers and transceivers that provide reliable performance in a variety of applications. Offering 8 bits of data transmission, this product boasts a fast propagation delay of just 30ns, ensuring efficient signal processing. The small outline package makes it easy to integrate into your projects, while the open-collector output characteristics offer flexibility. Trust Texas Instruments for cutting-edge technology that enhances your systems' efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments and conditions.

Propagation Delay At Nominal Supply: 30 ns

With a low propagation delay, this product ensures fast and efficient data transmission.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic circuits.

No. of Bits: 8

Provides sufficient data processing capability for bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard and commonly used voltage, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for use in various industrial and automotive applications.

Technical Specifications

Bus Driver & Transceivers SN74ALS639ADWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR/3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

54 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ALS639ADWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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