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SN74ALS638ADWE4

Texas Instruments

SN74ALS638ADWE4 by Texas Instruments

SN74ALS638ADWE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 30ns at 5V. It features open-collector/3-state output characteristics and operates b/w 0 to 70°C. Commonly used in bidirectional control applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,987 parts In-Stock

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Digiode

USA . 994 parts In-Stock

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994

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Distributors (Availability)

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Parana Technologies

USA . 33 parts In-Stock

1+ parts

$8.975

100+ parts

-

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$9.646

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33

$8.975

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$9.646

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DigiPath Technology Company

USA . 1,101 parts In-Stock

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$9.882

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$9.882

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AZTECH Wire

Italy . 793 parts In-Stock

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$10.014

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793

$10.014

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

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$10.084

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$9.580

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$9.076

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1,748

$10.084

$9.580

$9.076

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ChromeModa Solutions

Germany . 1,659 parts In-Stock

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$10.084

100+ parts

$8.269

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1,659

$10.084

$8.269

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Andel Nordic

Denmark . 3,725 parts In-Stock

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$11.150

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$10.704

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$10.704

3,725

$11.150

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$10.704

$10.704

One Stop Electronics

USA . 455 parts In-Stock

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$21.000

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Corphita

USA . 1,846 parts In-Stock

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Microchip USA

USA . 355 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the SN74ALS638ADWE4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their Bus Driver & Transceivers category. This product offers customers unmatched value with its fast propagation delay, versatile applications, and high performance features. Whether you're looking to enhance your electronic projects or streamline your communication systems, the SN74ALS638ADWE4 is the perfect solution for all your needs. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast data transmission, making this product ideal for high-speed applications where timing is critical.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data inputs and outputs, making it versatile for various communication protocols and systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Technical Specifications

Bus Driver & Transceivers SN74ALS638ADWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR/3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

41 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ALS638ADWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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