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SN74ALS573CNSR

Texas Instruments

SN74ALS573CNSR by Texas Instruments

BUS DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$1.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 672 parts In-Stock

1+ parts

$1.500

100+ parts

$1.410

1k+ parts

$1.110

10k+ parts

$0.887

672

$1.500

$1.410

$1.110

$0.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$0.495

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$0.495

-

-

-

Digiode

USA . 2,767 parts In-Stock

1+ parts

$1.378

100+ parts

-

1k+ parts

-

10k+ parts

-

2,767

$1.378

-

-

-

Vyrian

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.495

100+ parts

-

1k+ parts

$0.470

10k+ parts

$0.460

50

$0.495

-

$0.470

$0.460

Ampacity Inc.

Singapore . 670 parts In-Stock

1+ parts

$1.270

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$1.270

-

-

-

Corphita

USA . 2,664 parts In-Stock

1+ parts

$1.305

100+ parts

-

1k+ parts

-

10k+ parts

-

2,664

$1.305

-

-

-

Component Stockers USA

USA . 23,289 parts In-Stock

1+ parts

$1.400

100+ parts

$0.980

1k+ parts

$0.460

10k+ parts

$0.460

23,289

$1.400

$0.980

$0.460

$0.460

Microchip USA

USA . 1,035 parts In-Stock

1+ parts

$3.971

100+ parts

-

1k+ parts

-

10k+ parts

-

1,035

$3.971

-

-

-

Andel Nordic

Denmark . 325 parts In-Stock

1+ parts

$7.327

100+ parts

-

1k+ parts

$7.034

10k+ parts

$7.034

325

$7.327

-

$7.034

$7.034

AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$10.560

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$10.560

-

-

-

Parana Technologies

USA . 1,723 parts In-Stock

1+ parts

$22.181

100+ parts

-

1k+ parts

$22.820

10k+ parts

-

1,723

$22.181

-

$22.820

-

DigiPath Technology Company

USA . 1,874 parts In-Stock

1+ parts

$24.424

100+ parts

$22.470

1k+ parts

-

10k+ parts

-

1,874

$24.424

$22.470

-

-

ChromeModa Solutions

Germany . 3,222 parts In-Stock

1+ parts

$24.922

100+ parts

$20.436

1k+ parts

-

10k+ parts

-

3,222

$24.922

$20.436

-

-

IDEA Electronic Components Group

UK . 858 parts In-Stock

1+ parts

$24.922

100+ parts

$23.676

1k+ parts

$22.430

10k+ parts

-

858

$24.922

$23.676

$22.430

-

Perfect Parts

USA . 2,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,233

-

-

-

-

Technical Specifications

Bus Driver & Transceivers SN74ALS573CNSR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ALS573CNSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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