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SN74ALS573CNE4

Texas Instruments

SN74ALS573CNE4 by Texas Instruments

SN74ALS573CNE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 14 ns at 5V. It features a 3-STATE output, operates b/w 0 to 70°C, and has a max power supply current of 27 mA. Ideal for applications requiring true output polarity control in commercial temperature grades.

Median Price

$2.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 231 parts In-Stock

1+ parts

$2.570

100+ parts

$1.210

1k+ parts

$0.738

10k+ parts

$0.692

231

$2.570

$1.210

$0.738

$0.692

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,855 parts In-Stock

1+ parts

$1.358

100+ parts

-

1k+ parts

-

10k+ parts

-

1,855

$1.358

-

-

-

Vyrian

USA . 3,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,306

-

-

-

-

Semi Source

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Bristol Electronics

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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48

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,550 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

-

10k+ parts

-

2,550

$1.287

-

-

-

Component Stockers USA

USA . 823 parts In-Stock

1+ parts

$1.390

100+ parts

$0.960

1k+ parts

-

10k+ parts

-

823

$1.390

$0.960

-

-

Andel Nordic

Denmark . 3,984 parts In-Stock

1+ parts

$4.215

100+ parts

-

1k+ parts

$4.046

10k+ parts

$4.046

3,984

$4.215

-

$4.046

$4.046

Parana Technologies

USA . 261 parts In-Stock

1+ parts

$22.141

100+ parts

-

1k+ parts

$22.763

10k+ parts

-

261

$22.141

-

$22.763

-

DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$24.379

100+ parts

$22.429

1k+ parts

-

10k+ parts

-

1,453

$24.379

$22.429

-

-

ChromeModa Solutions

Germany . 99 parts In-Stock

1+ parts

$24.877

100+ parts

$20.399

1k+ parts

-

10k+ parts

-

99

$24.877

$20.399

-

-

IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$24.877

100+ parts

$23.633

1k+ parts

$22.389

10k+ parts

-

32

$24.877

$23.633

$22.389

-

Microchip USA

USA . 1,693 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,693

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Overview

Experience unparalleled performance and reliability with the SN74ALS573CNE4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge bus drivers & transceivers that are ideal for a wide range of applications. With 8 bits, 3-state output characteristics, and a fast propagation delay of just 20 ns, this product ensures seamless data transmission. The SN74ALS573CNE4 boasts a durable plastic/epoxy package body material, along with a nickel/palladium/gold terminal finish, making it a top choice for commercial-grade projects. Trust Texas Instruments to provide you with a high-quality solution that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 14 ns

Offers fast signal transmission and response times, making the product efficient and timely.

No. of Bits: 8

Provides ample connectivity options and data transfer capabilities.

Nominal Supply Voltage / Vsup (V): 5

Matches standard power requirements for compatibility with many systems and devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures reliable electrical connections and prevents corrosion for long-lasting performance.

Output Polarity: TRUE

Maintains signal integrity and consistency in data transmission.

Technology: TTL

Utilizes a well-established and reliable technology for signal processing and communication.

Maximum Power Supply Current (ICC): 27 mA

Efficient power consumption for energy savings and reduced operating costs.

Technical Specifications

Bus Driver & Transceivers SN74ALS573CNE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74ALS573CNE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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