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SN74ALS29827DWG4

Texas Instruments

SN74ALS29827DWG4 by Texas Instruments

SN74ALS29827DWG4 by Texas Instruments is a 10-bit bus driver with 3-STATE output characteristics. It has a propagation delay of 15 ns at nominal voltage of 5V, making it suitable for applications requiring fast signal transmission. With a package style of SMALL OUTLINE and surface mount capability, it is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,005 parts In-Stock

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8,005

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Digiode

USA . 4,397 parts In-Stock

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4,397

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Distributors (Availability)

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One Stop Electronics

USA . 349 parts In-Stock

1+ parts

$3.000

100+ parts

-

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349

$3.000

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AZTECH Wire

Italy . 202 parts In-Stock

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$17.128

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202

$17.128

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Parana Technologies

USA . 1,881 parts In-Stock

1+ parts

$18.355

100+ parts

$1,704.574

1k+ parts

$16.520

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1,881

$18.355

$1,704.574

$16.520

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DigiPath Technology Company

USA . 2,052 parts In-Stock

1+ parts

$20.212

100+ parts

$18.595

1k+ parts

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2,052

$20.212

$18.595

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ChromeModa Solutions

Germany . 3,030 parts In-Stock

1+ parts

$20.624

100+ parts

$16.912

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3,030

$20.624

$16.912

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IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$20.624

100+ parts

$19.593

1k+ parts

$18.562

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2,010

$20.624

$19.593

$18.562

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Ampacity Inc.

Singapore . 321 parts In-Stock

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$40.000

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321

$40.000

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Component Stockers USA

USA . 749 parts In-Stock

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$99.990

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749

$99.990

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Corphita

USA . 2,725 parts In-Stock

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2,725

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Microchip USA

USA . 1,109 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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45

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Overview

Unlock seamless data transmission with the SN74ALS29827DWG4 by Texas Instruments. Crafted with precision and reliability in mind, this bus driver & transceiver ensures fast and efficient communication between components. Ideal for a wide range of applications, this product offers unparalleled value with its high-quality construction and advanced technology. Experience the benefits of smooth data flow and enhanced performance with the SN74ALS29827DWG4, setting new standards in connectivity and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in a variety of environments.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay ensures fast and efficient communication between devices, making this product suitable for time-critical applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and components.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling multiple drivers to share the same bus without interference, enhancing flexibility in system design.

Technology: TTL

TTL technology ensures reliable and efficient signal transmission, making this product a dependable choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers SN74ALS29827DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

300 pF

Logic IC Type:

Maximum I (ol):

48 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ALS29827DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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